Electrodeposition of Cu nanowires with ultrahigh-density twin boundaries: An electrochemical perspective on nanotwinning

Hao-Che Huang,Hsin-Yu Chen,Chien-Neng Liao
DOI: https://doi.org/10.1039/d4nr03537b
IF: 6.7
2024-12-05
Nanoscale
Abstract:Many spectacular nanotwinned Cu (nt-Cu) properties depend on the spacing of adjacent twin boundaries (TBs) inside crystal grains. The average TB spacing is typically 10 – 100 nm in electrodeposited nt-Cu films. This study employed template-assisted electrodeposition to grow nt-Cu nanowires with high-density TBs (average TB spacing < 5 nm). The effect of Cu seed annealing and template pore size on TB spacing was systematically investigated through microstructural characterization and electrochemical analysis. A model based on stress accumulation level and electrochemical parameters was proposed to assess the twinning criteria during the electrodeposition of nt-Cu nanowires. This research provides mechanistic insights into the nanotwinning process and highlights the potential for the control of twin structures in nanomaterials.
materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry
What problem does this paper attempt to address?