Abstract:In the field of advanced electronic packaging, the common method for structural interconnection is using Sn-based solder and Cu-based substrate soldering. However, the reaction between Sn-based solder and Cu-based substrate is rapid, leading to the formation of thick and brittle Cu-Sn IMCs at the interface, causing stress concentration in the solder joint. Meanwhile, the consumption of Cu substrate results in the generation of Kirkendall voids, leading to a sharp decrease in mechanical performance and eventual fracture. During production, a diffusion barrier layer is typically introduced between the solder and substrate to suppress the formation of Cu-Sn IMCs and enhance the reliability of the solder joint. Currently, the industry often employs Ni-P plating as the diffusion barrier layer. However, the Ni-P diffusion barrier layer is prone to long-term failure. In the soldering process, Ni-P generates columnar crystalline structure Ni3P, providing diffusion pathways for atoms. By introducing the new element W, the recrystallization of the barrier layer can be effectively suppressed, promoting the formation of an amorphous structure, eliminating grain boundaries as diffusion pathways, thereby exhibiting excellent diffusion barrier performance, especially improved thermal stability. Based on this background, this work developed a ternary Ni-W-P diffusion barrier layer prepared by electroplating (with a P content of 14-15wt% and W content of 7-8wt%), which exhibits uniform dense coating and good thermal stability. The study compared the interface reactions of Cu/Ni-W-P/Sn-58Bi and Cu/Ni-P/Sn-58Bi after soldering at 180°C for different durations. The results indicate that the IMC layer at the Cu/Ni-P/Sn-58Bi interface grows rapidly, whereas under the same heat treatment, the thickness of the IMC layer at the Ni-W-P/Sn-58Bi interface is significantly smaller than that of the Ni-P interface layer, with the IMC layer mainly composed of (Ni, Cu)3Sn4 phase. The solder joints formed in Ni-W-P/Sn-58Bi are very thin and stable during different soldering processes, demonstrating the blocking effect of the Ni-W-P layer. The findings reveal that Ni-W-P coatings hold great promise as diffusion barrier layers, capable of enhancing the reliability of long-term reflow soldering procedures.

Exploration of Pretreatment Process and Wettability of High Bonding Ni-P Coatings on W-Cu Composites for Electronic Packaging

The Interfacial Reaction between Amorphous Ni-W-P Coating and Sn-58Bi Solder

Enhanced electroless Ni-P plating quality on binderless tungsten carbide by atmospheric pressure plasma pretreatment

Electroplated Ni-W-P Amorphous Layer and the Interaction Between Ni-W-P Barrier and Sn-Bi Solder

PREPARATION OF ULTRAFINE W–Cu COMPOSITE POWDER USING ULTRASONIC-ASSISTED ELECTROLESS PLATING

Study on property of electroless plating Ni-W-P coating

Electrodeposition Processing of Porous Cu/Ni Composites and Their Performance

Corrosion Characteristics of Electroless Ni–P Coatings Deposited on W–Cu Composite

Effects Of Ni-W(Au) Coated Cu Microcones On The Bonding Interfaces

Electroless Ni-W-P alloy as a barrier layer between Zn-based high temperature solders and Cu substrates

Preparation of Nickel-Coated Tungsten Carbide Powders by Room Temperature Ultrasonic-Assisted Electroless Plating

Influence of Pretreatment Processes on Adhesion of Ni/Cu/Ni Multilayer on Polyetherimide Resin Reinforced with Glass Fibers

Effects of Simplified Pretreatment Process on the Morphology of W–Cu Composite Powder Prepared by Electroless Plating and Its Sintering Characterization

Diffusion Barrier Property of Electroless Ni-W-P Coating in High Temperature Zn-5Al/Cu Solder Interconnects

Study on Process Optimization of Electroless Ni-P Plating on Binderless WC

Study on Electroless Plating Ni-W-P Ternary Alloy with High Tungsten from Compound Complexant Bath

Preparation of Mo/Cu composite powders with ultrasonic electroless plating copper

Synthesis, Composition, Morphology, and Wettability of Electroless Ni-Fe-P Coatings with Varying Microstructures

Effect of Electroless Plating Ni–Cu–P Layer on the Wettability Between Cemented Carbides and Soldering Tins

Effect of Electrodeposited Cu Interlayer Thickness on Characterizations and Adhesion Force of Ni/Cu/Ni Coatings on Polyetherimide Composite Substrates

Formation Mechanism of W-coated Cu Composite Powders and the Metal Injection Molding Using Polyoxymethylene-Based Binders