Abstract:In order to solve the problem of high cost of chip testing in the process of Three-Dimensional (3D) chip manufacturing,a new scheduling method based on Time Division Multiplexing (TDM) was proposed to optimize the testing resources between layers,layer and core cooperatively.Firstly,the shift registers were arranged on each layer of 3D chip,and the testing frequency was divided properly between the layers and cores of the same layer under the control of shift register group on input data,so that the cores in different locations could be tested in parallel.Secondly,greedy algorithm was used to optimize the allocation of registers for reducing the free test cycles of core parallel test.Finally,Discrete Binary Particle Swarm Optimization (DBPSO) algorithm was used to find out the best 3D stack layout,so that the transmission potential of the Through Silicon Via (TSV) could be adequately used to improve the parallel testing efficiency and reduce the testing time.The experimental results show that,under the power constraints,the utilization rate of the optimized whole Test Access Mechanism (TAM) is increased by an average of 16.28％,and the testing time of the optimized 3D stack is reduced by an average of 13.98％.The proposed method can decrease the time and reduce the cost of testing.

Integrated Test-Architecture Optimization and Thermal-Aware Test Scheduling for 3-D SoCs under Pre-Bond Test-Pin-Count Constraint

Layout-driven Test-Architecture Design and Optimization for 3D SoCs under Pre-Bond Test-Pin-count Constraint

Test Architecture Design and Optimization for Three-Dimensional SoCs

Reconfigured Test Architecture Optimization For Tsv-Based Three-Dimensional Socs

A Cost-Effective Pre-Bond Functional Test Architecture for 3d Socs

Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test

Thermal-Aware Test Scheduling For Noc-Based 3d Integrated Circuits

Optimizing pre-bond and post-bond test time for three dimension IP cores

A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs

Dual-Speed TAM Optimization of 3D SoCs for Mid-bond and Post-bond Testing

SoC Test Scheduling with Hot-Spot Avoidance and Even Heat Distribution

Scheduling Tests for 3D Stacked Chips under Power Constraints

Multicast-Based Testing and Thermal-Aware Test Scheduling for 3d Ics with A Stacked Network-On-Chip

A Thermal-Driven Test Application Scheme for 3-Dimensional ICs

Parallel test scheduling optimization method for three-dimensional chip with multi-core and multi-layer

Three Dimensional ICs Thermal-Driven Test Application Scheme

Optimization of 3D IC Routing Based on Thermal Equalization Analysis

BIST Methodology, Architecture and Circuits for Pre-Bond TSV Testing in 3D Stacking IC Systems

Thermal-aware SoC Test Scheduling with Voltage/Frequency Scaling and Test Partition

Temperature-aware Test Scheduling for Multiprocessor Systems-on-chip