Layout-driven Test-Architecture Design and Optimization for 3D SoCs under Pre-Bond Test-Pin-count Constraint

Li Jiang,Qiang Xu,Krishnendu Chakrabarty,T. M. Mak
DOI: https://doi.org/10.1145/1687399.1687434
2009-01-01
Abstract:We propose a layout-driven test-architecture design and optimization technique for core-based system-on-chips (SoCs) that are fabricated using three-dimensional (3D) integration. In contrast to prior work, we consider the pre-bond test-pin-count constraint during optimization since these pins occupy large silicon area that cannot be used in functional mode. In addition, the proposed test-architecture design takes the SoC layout into consideration and facilitates the sharing of test wires between pre-bond tests and post-bond test, which significantly reduces the routing cost for a test-access mechanism in 3D technology. Experimental results for the ITC'02 SoC benchmarks circuits demonstrate the effectiveness of the proposed solution.
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