Abstract:Vertical integration (3D ICs) has demonstrated the potential to reduce inter-block wire latency through flexible block placement and routing. However, there is an untapped potential for 3D ICs to reduce intra-block wire latency through architectural designs that can leverage multiple silicon layers in innovative ways. Furthermore, it is particularly challenging to simultaneously explore the physical design space and microarchitectural space for vertical integration. The physical design space typically has no information on the microarchitectural impact of latency optimization, and the microarchitectural space has no information on the physical design impact of different architectural alternatives. We make the following contributions in this paper: (1) the introduction of port partitioning, a new approach to constructing multi-layer blocks; (2) the extension of a microarchitectural exploration tool to include the ability to model multilayer blocks and to consider these blocks as alternative implementations of single-layer architectural blocks on the fly, within a single floorplanning run; and (3) the evaluation of vertical integration on a design driver using this framework. For this design driver, we see an average 36% improvement in performance (measured in BIPS) over a single-layer architecture, and a 29% improvement in performance over a multi-layer architecture with single-layer blocks. The on-chip temperature is kept below 40°C.

Test Architecture Design and Optimization for Three-Dimensional SoCs

Reconfigured Test Architecture Optimization For Tsv-Based Three-Dimensional Socs

Cost-Effective Test Optimized Scheme of TSV-Based 3D SoCs for Pre-Bond Test

Dual-Speed TAM Optimization of 3D SoCs for Mid-bond and Post-bond Testing

New Dft Architectures for 3D-Sics with A Wireless Test Port

Three Dimensional ICs Thermal-Driven Test Application Scheme

Design and Fabrication of a Test Chip for 3D Integration Process Evaluation

Three-dimensional Integrated Circuits: Design, EDA, and Architecture

A thermal-driven test application scheme for pre-bond and post-bond scan testing of three-dimensional ICs

Design space exploration for 3D integrated circuits

Fine Grain 3D Integration for Microarchitecture Design Through Cube Packing Exploration.

A Thermal-Driven Test Application Scheme for 3-Dimensional ICs

An improved method for test chip design

Extending Systems-on-chip to the Third Dimension: Performance, Cost and Technological Tradeoffs

3D architecture modeling and exploration

Cost-driven 3D Integration with Interconnect Layers

A 3D Integration Testing Vehicle with TSV Interconnects

System-level optimization of Network-on-Chips for heterogeneous 3D System-on-Chips

Investigating the Effects of Fine-Grain Three-Dimensional Integration on Microarchitecture Design

O.O: Optimized One-die Placement for Face-to-face Bonded 3D ICs

Hybrid Thermal Aware Reconfigurable 3d Ic with Dynamic Power Gating Architecture