Optimizing pre-bond and post-bond test time for three dimension IP cores

Jun LIU,Qingqing QIAN,Xi WU,Wei WANG,Tian CHEN,Fuji REN
DOI: https://doi.org/10.3778/j.issn.1002-8331.1412-0164
2016-01-01
Abstract:To reduce pre-bond and post-bond test time of three dimensional IP(Intellectual Property)cores, this paper pro-poses a test wrapper optimization technique. The proposed technique maps scan elements to a plane, and BFD algorithm is employed to allocate scan elements to each wrapper chain to reduce post-bond test time. Secondly, AL(Allocate Layer) algorithm is presented to allocate scan elements to each circuit layer to balance pre-bond wrapper chains, which can effec-tively reduce pre-bond test time and the number of TSVs. Besides, AL algorithm can also make the total length of scan elements in each layer as equal as possible. Experiments show that the proposed technique can further reduce test time by 3.17%~38.18%, and balance the length of total scan elements in each circuit layer of 3D IP core.
What problem does this paper attempt to address?