On the Abnormal Reduction and Recovery of Dynamic R ON under UIS Stress in Schottky p-GaN Gate HEMTs

Chao Liu,Xinghuan Chen,Ruize Sun,Jingxue Lai,Wanjun Chen,Yajie Xin,Fangzhou Wang,Xiaoming Wang,Zhaoji Li,Bo Zhang
DOI: https://doi.org/10.1109/tpel.2023.3276316
IF: 5.967
2023-01-01
IEEE Transactions on Power Electronics
Abstract:In this letter, the abnormal reduction and recovery of dynamic RON is observed under UIS (unclamped-inductive-switching) stress in Schottky p-GaN gate HEMTs. The reduction of RON_dyn exhibits the positive dependence on UIS stress (VPEAK, peak voltage). With the help of Sentaurus simulation, the underlying physical mechanism is revealed. During UIS stress, the e-h pairs generated by impact ionization (I.I.) can be trapped, and the de-trapping of electrons is faster than holes because of the lower time constant, which result the reduction of RON_dyn. Furthermore, a mathematic model of RON_dyn after UIS stress is developed, and verified by measurement. This work could provide a practical guidance for the UIS operation setup to reduce the RON and conduction loss of GaN HEMTs.
engineering, electrical & electronic
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