Study on electroless Cu plating quality of in situ TiCp

Dongdong Zhang,Yu Liu,Yali Gao,Jinguo Wang
DOI: https://doi.org/10.1038/s41598-020-69105-9
IF: 4.6
2020-07-22
Scientific Reports
Abstract:Abstract In situ TiC p was fabricated via combustion synthesis in an Al–Ti–C system. The quality of copper plating was easily observable on the surface of spherical in situ TiC p . A study was conducted to assess the influences of the stirring method, plating temperature and particle-to-solution ratio. According to the results, magnetic stirring is an advantageous stirring method. During the plating process, the plating quality reaches the maximum level at 303 K under magnetic stirring. Moreover, uniform and dense plating is achieved when the particle-to-solution ratio reaches 1 g/100 ml. The concentration of solution and ion activity can affect the speed at which Cu 2+ is attached to the growing core, which plays a significant role in the quality of copper plating.
multidisciplinary sciences
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