Sintering Densification of Cu/Al2O3p Nano-Composite Powders by Electroless Copper Plating

刘远廷,凌国平,郦剑
DOI: https://doi.org/10.3321/j.issn:1004-0609.2004.03.025
2004-01-01
Abstract:Electroless plating is an effective method to prepare various metal/ceramic compounds, which can get a high mixing homogeneity and improved metal/ceramic interface bond in metal matrix composites(MMCs) reinforced by ceramic. The characteristics of sintering densification of Cu/Al_2O_(3p) composites were investigated. The influences of powder preparation, pressing pressure, sintering temperature, soaking time and repressing-resintering on the densification were studied. On the basis of optimizing parameters, the relative density of Cu/nano-Al_2O_(3p) with norminal content of 10% Al_2O_3(mass fraction) can reach 94% via conventional powder metallurgy.
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