Abstract:Recently, due to the promising properties of silver, the low-temperature silver sintering joining technology has become increasingly attractive in power electronics. Reliable bonding quality of sintered silver depends not only on the microstructure, but also on the interfacial properties to the joining materials. Sintering on precious metal surfaces such as silver or gold works very well due to the good interdiffusion behavior of these elements. Non-precious metal surfaces such as copper are preferred to reduce manufacturing costs as no additional surface metallization layer is required. Sintering on copper surfaces is usually performed in a nitrogen atmosphere, as they can potentially oxidize during sintering in an oxygen -containing atmosphere. The resulting copper oxide is proposed to act as a diffusion barrier, resulting in weak bonding of the silver compound to the copper surface. In this work, we observed that not only the substrate oxidation during sintering, but also the initial Cu oxide layer affects the bonding performance. Therefore, different copper oxidation methods were performed to produce different types of copper oxides and thicknesses on active metal brazed (AMB) substrates. X-ray photoelectron spectroscopy (XPS) measurements of the samples indicate the presence of two types of copper oxides, which further affect the bond strength of sintered Ag differently. Pressure sintering with micron Ag paste on a nearly oxide-free copper surface produces lower bond strength than sintering on oxidized substrates. The highest bond strength can be achieved on CuO, but the presence of Cu20 also contributes to the bonding of silver to the copper surface. If the oxide layer becomes too thick, bonding is no longer guaranteed. Higher sintering temperature and pressure results in a denser sintered layer and stronger bonding on copper substrates.

Influence of impurities on the sintering densification in nano- Al2O3 powders coated by copper

Sintering Densification of Cu/Al2O3p Nano-Composite Powders by Electroless Copper Plating

Influencing factors on the uniformity of copper coated nano-Al2O3 powders prepared by electroless plating

Influences of Metal Oxide Additions on the Morphology of Sintered AgSnO2 Composite Powders

Influences of Tin Oxide Surface Modification on the Morphology and Performance of Sintered Ag/SnO2 Composite Powders

Effect of the impurity in electroless plated Powders on morphology and properties of sintered AgSnO2 materials

Influence of sintering processes on the density of nano-AgSnO2 composites

Sintering of the ultrafine Ag-SnO2 powders prepared by electroless silver plating

Study of Hot-press Sintering Process of Nanometer Cu-Al_2O_3 Composite

Study on the Resistivity and Porosity of Nano Copper Powder Under Low-Temperature Sintering without Pressure

Preparation of Nano-Al2O3 Dispersion Strengthened Coating on Copper Surface

Understanding the Influence of Copper Substrate Oxidation on Silver Pressure Sintering Performance

Enhanced interfacial wettability and mechanical properties of Ni@Al2O3/Cu ceramic matrix composites using spark plasma sintering of Ni coated Al2O3 powders

Sintering Kinetics and Microstructure Evolution in Α-Al2o3 Nanocrystalline Ceramics: Insensitive to Fe Impurity

Thermal Analysis of Cu-Organic Composite Nanoparticles and Fabrication of Highly Conductive Copper Films

Investigation into the Peculiarities of Structure Formation and Properties of Copper-Based Powder Pseudoalloys Modified by ZnO and TiN Nanoparticle Additives

Effect of Sintering Temperature for Die-shear Strength of Non-pressure Sintering Copper Paste on Metal Plating

Effects of initial Cu grain size and impurity residues on the liquid phase reactions between molten solder and electroplated Cu

Effect of pressure on nano copper sintering in interconnections of power device

Study on the Sintering Characteristics and Application in Cu Bulk Bonding of Ag-nanoparticle Paste

Preparation and anti-oxidisation resistance of silver-coated copper powders by cobalt-modified copper powders