Study on the preparation process and sintering performance of doped nano-silver paste
Hui Yang
DOI: https://doi.org/10.1515/rams-2022-0273
2022-01-01
REVIEWS ON ADVANCED MATERIALS SCIENCE
Abstract:Abstract After tin–lead solders are banned, the widely used electronic packaging interconnect materials are tin–silver, tin–copper, and other alloy solders. With the application of high-power devices, traditional solders can no longer meet the new requirements. Nano-silver (Ag) paste, as a new solder substitute, exhibits excellent properties, such as excellent thermal and electrical conductivity, sintering at lower temperatures, and service at high temperatures. However, many organic devices still cannot withstand this temperature, and are often not suitable for the connection of nano-Ag paste packaging materials, therefore, it is very urgent to further reduce the sintering temperature of nano-silver paste. Based on the transient liquid phase sintering technology, by doping the nano-Ag paste with the nano-tin paste with a lower melting point to make the two uniformly mix, pressureless sintering at low temperature can be realized, and a sintered joint with a connection strength greater than 20 MPa can be formed. Considering that tin is easy to be oxidized, and the core–shell material can prevent the oxidation of tin, and at the same time ensure the uniform distribution of tin in silver, the doping scheme of the core–shell structure is determined. Heterogeneous flocculation method refers to the particles with different properties of charges which attract each other and agglomerate. It is a continuous reduction method for preparing core–shell materials. This method has the advantages of mild reaction conditions and less equipment investment, so the heterogeneous flocculation method is selected to prepare Sn@Ag core–shell nano paste. And research its sintering performance and strengthening mechanism.
materials science, multidisciplinary,nanoscience & nanotechnology