Abstract:Recently, due to the promising properties of silver, the low-temperature silver sintering joining technology has become increasingly attractive in power electronics. Reliable bonding quality of sintered silver depends not only on the microstructure, but also on the interfacial properties to the joining materials. Sintering on precious metal surfaces such as silver or gold works very well due to the good interdiffusion behavior of these elements. Non-precious metal surfaces such as copper are preferred to reduce manufacturing costs as no additional surface metallization layer is required. Sintering on copper surfaces is usually performed in a nitrogen atmosphere, as they can potentially oxidize during sintering in an oxygen -containing atmosphere. The resulting copper oxide is proposed to act as a diffusion barrier, resulting in weak bonding of the silver compound to the copper surface. In this work, we observed that not only the substrate oxidation during sintering, but also the initial Cu oxide layer affects the bonding performance. Therefore, different copper oxidation methods were performed to produce different types of copper oxides and thicknesses on active metal brazed (AMB) substrates. X-ray photoelectron spectroscopy (XPS) measurements of the samples indicate the presence of two types of copper oxides, which further affect the bond strength of sintered Ag differently. Pressure sintering with micron Ag paste on a nearly oxide-free copper surface produces lower bond strength than sintering on oxidized substrates. The highest bond strength can be achieved on CuO, but the presence of Cu20 also contributes to the bonding of silver to the copper surface. If the oxide layer becomes too thick, bonding is no longer guaranteed. Higher sintering temperature and pressure results in a denser sintered layer and stronger bonding on copper substrates.

Mechanism of Low Temperature Sintering-Bonding Through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

A Study on the Low Temperature Sintering-Bonding Through In-Situ Formation of Ag Nanoparticles Using Ag2o Microparticles

Low Temperature Sintering-Bonding Through In-Situ Formation of Ag Nanoparticles Using Micro-Scaled Ag_2O Composite Paste

Bonding of Cu to Cu bulks through the low temperature sintering of Ag nanoparticle paste

Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications

Low Temperature Bonding of Cu Metal through Sintering of AgNanoparticles for High Temperature Electronic Application

Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging

Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles

Interfacial Nano-Mechanical Properties of Copper Joints Bonded with Silver Nanopaste Near Room Temperature

Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application

Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature

Study on the Sintering Characteristics and Application in Cu Bulk Bonding of Ag-nanoparticle Paste

Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application

The Mechanisms of Oxygen Accelerated Low Temperature Bonding by Ag Nanoparticles

Understanding the Influence of Copper Substrate Oxidation on Silver Pressure Sintering Performance

Effects of Oxygen Content on Low-Temperature Bonding Using Organic-Free Silver Nanostructured Film with Different Types of Substrate Metallization

Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging

Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature

Low Temperature Bonding of Metals by Deposition of Nanoparticles at the Interface

Sintering bonding process with Ag nanoparticle paste and joint properties in high temperature environment