The Mechanisms of Oxygen Accelerated Low Temperature Bonding by Ag Nanoparticles

Wengan Wang,Guisheng Zou,Na Chen,Qiang Jia,Bin Feng,Hongqiang Zhang,Zhongyang Deng,Lei Liu

DOI: https://doi.org/10.1002/ppsc.202200195

2023-01-27

Abstract:Low temperature bonding (≤300 o C) using Ag nanoparticles (Ag NPs) is considered to be the new generation of bonding technology in power electronics. The oxygen accelerated sintering has been observed by many reserchers which was attributed to the decomposition of organics covered on Ag NPs. In this work, organic‐free Ag NPs were fabricated to elimiate the influence of orgnaics, and we find that the accelerated bonding process by oxygen is strongly correlated to the self‐confined amorphous Ag‐O compound shell on the surface of Ag NPs. In experiments, the sintering process is apparently accelerated by the elevating oxygen content, and the amorphous shell is observed after sintering, which did not grow thicker even in pure oxygen ambient for long time while performed active chemical evolutions. In simulations, the results match well with the experiments and indicate that the amorphous shell performed the dynamic oxidation and decomposition process. This dynamic equilibrium was caused by the instability of silver oxides, which would enable the amorphous shell to activate the mobility of the surface mass flow and promote the surface diffusion. The shear strength of SiC chip increased 354% when bonding in pure oxygen, targeting a broad variety of applications in electronic packaging. This article is protected by copyright. All rights reserved

materials science, multidisciplinary,chemistry, physical,nanoscience & nanotechnology