Abstract:Lead-based solders bring pollution to the environment and result in health threat to humans.The preparation and application of metallic nanoparticles provide a potential method to develop Pb-free bonding materials.In this article, bonding of Ag-coated Cu bulks was realized through low temperature sintering by directly using the chemically-reduced Ag nanoparticle paste and baked nanoparticle powders at 60 o C, respectively.The results indicate that the capillary flow of paste caused a ring-like deposit on substrate coating, while this phenomenon disappeared when using the powders.Increasing bonding temperature facilitated the sintering, and shear strengths of 20 MPa and 84 MPa was obtained at bonding temperature of 250 o C for 30 min under 20 MPa when using the Ag paste and powders, respectively.High joint strength value of bonded region using paste is due to the high effective bonding pressure and small effective bonded area.Finally, for the extensive application in packaging industry especially for high temperature electronics, challenges such as the improvement of screen and stencil printing ability of paste, avoiding bonding pressure and lowering the cost were pointed out based on our and other researcher's achievements.Cu nanoparticle or Cu-containing nanoparticle mixture pastes are promising but the problems of oxidation and bonding stability must be resolved urgently.

Low Temperature Bonding of Cu Metal through Sintering of AgNanoparticles for High Temperature Electronic Application

Bonding of Cu to Cu bulks through the low temperature sintering of Ag nanoparticle paste

Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging

A Study on the Low Temperature Sintering-Bonding Through In-Situ Formation of Ag Nanoparticles Using Ag2o Microparticles

Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Low Temperature Sintering-Bonding Through In-Situ Formation of Ag Nanoparticles Using Micro-Scaled Ag_2O Composite Paste

Study on the Sintering Characteristics and Application in Cu Bulk Bonding of Ag-nanoparticle Paste

Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application

Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application

Cu-Ag Nanocomposite Pastes for Low Temperature Bonding and Flexible Interlayer-Interconnections

Sintering bonding process with Ag nanoparticle paste and joint properties in high temperature environment

Low-Temperature Cu-Cu Bonding Using Silver Nanoparticles Fabricated by Physical Vapor Deposition

Mechanism of Low Temperature Sintering-Bonding Through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

Synthesis with Glucose Reduction Method and Low Temperature Sintering of Ag-Cu Alloy Nanoparticle Pastes for Electronic Packaging

Low Temperature Cu-Cu Bonding Using Ag Nanoparticles By Pvd

Interfacial Bonding Mechanisms of Sintered Cu Nanoparticles on Different Metallization Surfaces

Cu-Cu joining using citrate coated ultra-small nano-silver pastes

Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition

Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications

A Novel Preparation of Ag Agglomerates Paste with Unique Sintering Behavior at Low Temperature

Low Temperature Cu-Cu Bonding Using Ag Nanostructure for 3d Integration