Abstract:Substrate metallization is a crucial factor affecting the mechanical properties of sintered nanoparticles in microelectronics applications, as it is essential for ensuring good adhesion between the substrate and the sintered material. In this study, we investigated the influence of metallization on pressure-assisted nanocopper sintering and analyzed the related mechanism of interaction using experiments and molecular dynamics simulation. In the first session, we bonded dummy dies on various substrates, including bare Cu, and substrates with Ag or Au metallization by nanocopper pressure-assisted sintering. The mechanical properties of the bonding layers were estimated using shear strength and SEM image analysis of fracture and cross-section morphologies under different sintering conditions. We found that the group of Cu-bare Cu have better bonding strength as the sintering temperature or assisted pressure is not high enough. However, as more energy input to the bonding layer, such as higher temperature or larger sintering pressure, the mechanical performance showed a significant increase. In the second session, a sintering model, which contained a single nanoparticle and substrate, was built to illustrate the effects of metallization from the perspective of solid-state wetting. The contact angle was estimated using a creative method, and the crystallization structure evolutions under different sintering conditions were analyzed. We found that the lattice boundary generated as the Cu nanoparticle coalescence with Ag or Au substrate, which may decrease the bonding strength. However, for Ag and Au metallization, limited interface diffusion can be observed at the neck region, where a few numbers of substrate atoms transmitted toward Cu nanoparticle, and the contact area was larger than that of bare Cu substrate. Finally, a simple uniaxial stretching simulation was conducted to prove the results of sintering simulation. This study provides valuable insights into the effects of metallization on pressure-assisted nanocopper sintering, which can contribute to the optimization of mechanical properties of sintered nanoparticles in microelectronics applications.

Interfacial Bonding Mechanisms of Sintered Cu Nanoparticles on Different Metallization Surfaces

Analysis of Metallization Effects of Pressure-Assisted Cu Nanoparticle Sintering on DBC by Experiment and Nanoscale Simulation

Bare Copper Bonding with Facilely Synthesized Ag Nanoparticles Decorated Cu Microparticles Paste

Sintering Mechanism of a Supersaturated Ag-Cu Nanoalloy Film for Power Electronic Packaging

Rapid and Low Temperature Sintering Bonding Using Cu Nanoparticle Film for Power Electronic Packaging

Bonding of Cu to Cu bulks through the low temperature sintering of Ag nanoparticle paste

Surface Effect Induced Cu-Cu Bonding by Cu Nanosolder Paste

Low Temperature Bonding of Cu Metal through Sintering of AgNanoparticles for High Temperature Electronic Application

Atomic-scale Study of Cu–Cu Direct Bonding with Assistance of Cu Nanoparticles As Joining Medium by Molecular Dynamics Simulation

Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications

Study on the Sintering Characteristics and Application in Cu Bulk Bonding of Ag-nanoparticle Paste

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

Understanding the Sintering Mechanism of Cu@Ag Nanoparticles for Power Device Packaging

Effect of surface finish metallization on interfacial bonding behavior of sintered Ag joints

Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging

Bonding Behavior and Quality of Pressureless Ag Sintering on (111)-Oriented Nanotwinned Cu Substrate in Ambient Air

Interfacial Nano-Mechanical Properties of Copper Joints Bonded with Silver Nanopaste Near Room Temperature

Facile Synthesis of Cu-Sn Nanoparticle Film and Its Bonding Mechanism for Power Electronic Packaging

Sintering of Mixed CuAg Nanoparticles Pretreated by Formic Acid Vapor for CuCu Low Temperature Bonding

Design of Cu Nanoaggregates Composed of Ultra-Small Cu Nanoparticles for Cu-Cu Thermocompression Bonding