Abstract:Copper (Cu) particle sintering is widely regarded as one of the most ideal interconnect technologies for wide band gap semiconductors owing to its potential for low-temperature curing while withstanding a higher working temperature. Nevertheless, the strict requirements for sintering conditions and high costs limit the widespread application of Cu sintering technology. In this paper, a simple vehicle was introduced into Cu paste formulation to achieve an effective sinter bonding even using commercially available sub-micron or even micrometer Cu particles (C-Cu particles) with the in-situ generation of composite Cu particles. This innovative vehicle comprises Cu salt, a combination of capping agents and reducing agents. The addition of the hybrid capping agent binds Cu atoms to the surface of the C-Cu particles and allows the generated Cu particles (G-Cu particles) produced from the vehicle to grow on their surface, resulting in the in-situ generation of composite Cu particles. Based on the in-situ generated composite Cu particles, sintering experiments were conducted at designated temperatures (200 °C, 225 °C, 250 °C) for various durations (3 min, 5 min, 10 min) in a N 2 atmosphere under different pressures (10 MPa, 15 MPa, 20 MPa). A reliable Cu sintered joint with a high shear strength of 41.3 MPa can be achieved at a low temperature (200 °C) using 500 nm C-Cu particles. Moreover, the joints sintered with large size (>3 μm) particles at 250 °C could also reach 43.3 MPa. The in-situ generated composite Cu particles accomplish the transformation of low-energy interfaces of C-Cu/C-Cu to high-energy interfaces of G-Cu/G-Cu, which in turn facilitates low-temperature sintered connection of C-Cu particles and reliable sintered joints formed of large size C-Cu particles. These findings improve the feasibility of Cu sinter bonding in practical applications.

Fabrication of Cu Particles with Porous Surface and Enhanced Sinter-Bondability between Cu Finishes by Physically In Situ Formation of Cu Nanoparticles Using Them

Growth of Surface Oxide Layers on Dendritic Cu Particles by Wet Treatment and Enhancement of Sinter-Bondability by Using Cu Paste Containing the Particles

Interfacial Bonding Mechanisms of Sintered Cu Nanoparticles on Different Metallization Surfaces

High performance Cu sintering joint for power devices enabled by in-situ generation of Cu particles with multi-level hierarchical structures

Study on the Sintering Characteristics and Application in Cu Bulk Bonding of Ag-nanoparticle Paste

Cu-Cu joint formation by low-temperature sintering of self-reducible Cu nanoparticle paste under ambient condition

Sintering Mechanism of Bimodal-Sized Cu Nanoparticle Paste for Power Electronics Packaging

Sintering Densification of Cu/Al2O3p Nano-Composite Powders by Electroless Copper Plating

Rapid and Low Temperature Sintering Bonding Using Cu Nanoparticle Film for Power Electronic Packaging

Extraordinarily enhanced sintering performance of pressureless sinterable Cu nanoparticle paste for achieving robust die-attach bonding by using reducing hybrid solvent

Enhanced shear strength and microstructure of Cu–Cu interconnection by low-temperature sintering of Cu nanoparticles

Improved sinter-bonding properties of silver-coated copper flake paste in air by the addition of sub-micrometer silver-coated copper particles

Ambient Aqueous-Phase Synthesis of Copper Nanoparticles and Nanopastes with Low-Temperature Sintering and Ultra-High Bonding Abilities

Low Temperature Bonding of Cu Metal through Sintering of AgNanoparticles for High Temperature Electronic Application

A mild aqueous synthesis of ligand-free copper nanoparticles for low temperature sintering nanopastes with nickel salt assistance

Suppression of Ag dewetting in submicron Cu@Ag particles in paste for improving sinter bondability through surface modification

Nano-Cu Paste Sintering in Pt-catalyzed Formic Acid Vapor for Cu Bonding at a Low Temperature

Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging

Bonding of Cu to Cu bulks through the low temperature sintering of Ag nanoparticle paste

Low Temperature Bonding of Metals by Deposition of Nanoparticles at the Interface