Abstract:Low temperature nanojoining has been identified as a challenging nanotechnology in the construction of nanoscale structures as well as microelectronic devices. Herein, three kinds of Ag–Cu nanopastes have been designed by mixing different organics with the Ag–Cu nanocrystalline particles synthesized in our previous work. The mechanical properties of sintered Ag–Cu nanopaste including hardness, Young’s modulus and shear strength were investigated and analyzed. It turned out that the sintered Ag–Cu nanopaste-B with 20 wt% addition of polyethylene glycol (PEG) has lower hardness and Young’s modulus, but a much higher shear strength than Ag–Cu nanopaste-A (1,2-propanediol) and -C (terpineol), which is superior to be considered as die-attach material for high temperature packaging material for wide band gap semiconductors. The uniform and dense sintered nanopaste-B layer presents a feature of eutectic microstructure comprised of Ag-rich and Cu-rich phases. It was also interesting to find that remarkable nanostructural solid solubility arose in Ag-rich phase (36 At% Cu) and Cu-rich phase (44 At% Ag). Moreover, the atomic inter-diffusion at interface could eventually interlock between the sintered nanopaste and substrate, which allows the Cu chip firmly attaching onto the Cu substrate. This work not only breaks through the synthesis bottleneck of Ag–Cu alloy NPs and a new bonding material, but also has the potential to affect a broad fields range.

Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application

Improvement of Bondability by Depressing the Inhomogeneous Distribution of Nanoparticles in a Sintering Bonding Process with Silver Nanoparticles

Large-Scale synthesis of silver nanoparticles by aqueous reduction for low-temperature sintering bonding

Low Temperature Bonding of Cu Metal through Sintering of AgNanoparticles for High Temperature Electronic Application

Polymer-Protected Cu-Ag Mixed NPs for Low-Temperature Bonding Application

Low-Temperature sintering bonding using silver nanoparticle paste for electronics packaging

A Study on the Low Temperature Sintering-Bonding Through In-Situ Formation of Ag Nanoparticles Using Ag2o Microparticles

Sintering mechanisms and mechanical properties of joints bonded using silver nanoparticles for electronic packaging applications

Effect of Pvp on the Low Temperature Bonding Process Using Polyol Prepared Ag Nanoparticle Paste for Electronic Packaging Application

Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging

A Review Of Sintering-Bonding Technology Using Ag Nanoparticles For Electronic Packaging

Preparation of Silver Nanosheets Used for Low Temperature Bonding

Low Temperature Bonding Process Using Mixed Cu-Ag Nanoparticles for Electronic Packaging

Characterization of low temperature bonding with Cu nanoparticles for electronic packaging application

Mechanism of Low Temperature Sintering-Bonding Through In-Situ Formation of Silver Nanoparticles Using Silver Oxide Microparticles

Synthesis of Sn-3.5ag Nanoparticles of Tiny Sizes

Sonochemical synthesis of silver nanoparticles coated copper wire for low-temperature solid state bonding on silicon substrate

Low Temperature Sintering-Bonding Through In-Situ Formation of Ag Nanoparticles Using Micro-Scaled Ag_2O Composite Paste

Low temperature nanojoining of silver–copper nanopaste as die attach material for high temperature packaging

Synthesis and Low-Temperature Sintering of Tin-Doped Silver Nanoparticles

Synthesis of Sn Nanoparticles and Their Size Effect on the Melting Point