Abstract:In electronic packaging industry, it has been reported that compared with nano silver and nano copper, the complementation and coordination of Ag and Cu components enable bimetallic nanomaterials enhanced anti-electromigration and oxidation inhibition characteristics. Ag-Cu solid solution nanoparticles (ACDS NPs) has become an emerging substitution and garnered widespread attention. This research presents the investigation into the size-dependent melting behaviour of ACDS NPs and the effect of elevated temperature during the pressure-free sintering with Ag substrate through molecular dynamics simulations. The melting points of ACDS NPs turn out to be in accordance with Gibbs Thomson equation, based on which the suitable sintering temperatures have been determined within 473 and 773 K. As demonstrated by dynamic trajectories at cross section while sintering, coalescence between NPs occurs with the atomic surface diffusion at the sintering neck along the vacancy concentration gradient. 623 K is estimated to be a threshold temperature of complete integration of NPs at which the crystallographic structure collapses during sintering and recrystallizes at the late sintering stage. The dominant sintering mechanisms transferred from surface diffusion and dislocation-based plastic deformation below 573 K to atomic diffusion above 623 K. Furthermore, the results present incontrovertible dominance of Shockley dislocations and interaction energy on determining mechanical properties of sintered atomistic system. It is also revealed that the systems sintered below 673 K yield significantly lower thermal conductivity attributing to the strong localization of heat carriers for intrinsic amorphous structure than crystalline counterparts above 723 K.

Synthesis of Sn Nanoparticles and Their Size Effect on the Melting Point

Synthesis and Low-Temperature Sintering of Tin-Doped Silver Nanoparticles

Effect of surfactants on the chemical preparation of tin-silver-copper nanoparticles

Reflow of Lead-Free Solder by Microwave Heating

Effect of Ag nanoparticles on microstructure, damping property and hardness of low melting point eutectic tin–bismuth solder

Lowering of Sn−Sb alloy melting points caused by substrate dissolution

Effects of High-Temperature Treatment on the Reaction Between Sn-3%Ag-0.5%Cu Solder and Sputtered Ni-V Film on Ferrite Substrate

J031041 Effect of Flux on the Microwave Reflow of Lead-Free Solder

In-situ investigation on melting characteristics of 1D SnCu alloy nanosolder

The influences of reactive nanoparticles alloying on grain boundary and melting properties about Sn3.0Ag0.5Cu solder

Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Atomic Insights into the Sintering Behaviour of Ag-Cu Solid Solution Nanoparticles on Ag Substrate

Synthesis, characterisation and formation mechanism of Sn-0.75 Cu solder nanoparticles by pulsed wire discharge

Influences of Tin Oxide Surface Modification on the Morphology and Performance of Sintered Ag/SnO2 Composite Powders

Low Temperature Bonding of Cu Metal through Sintering of AgNanoparticles for High Temperature Electronic Application

Large-scale synthesis of Ag nanoparticles by polyol process for low temperature bonding application

Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging

CoSn3 Intermetallic Nanoparticles for Electronic Packaging

Enhanced pressureless bonding by Tin Doped Silver Paste at low sintering temperature

Effect of Cu Particles on the Properties of Sn-Bi-Pb Low-Melting-Point Alloys

Effects of Nanoscale Cu 6 Sn 5 Particles Addition on Microstructure and Properties of SnBi Solder Alloys