Abstract:Pb-free solders are gaining ground as the optimum choice for electrical interconnect materials, however, their higher melting temperature around 217 °C is still an issue that restricts wider adoption. The potential to employ Bi substitution for Sn to lower solder joint processing temperatures has been widely considered. In this work, the mechanical properties of eutectic SAC with gradually increasing Bi substitution up to 10 wt% Bi was studied. It is shown that fracture strength ( increases with Bi additions from 50 MPa plateauing at 60 MPa between 1.4 and 1.8% Bi which represents the limits of solid solution strengthening. Over this substitutional range, strain at fracture ( dropped from 30 to 10% which was also evidenced by smaller percentage reduction in area (%RA). The was nearly 80 MPa for 2% Bi increasing gradually with increasing Bi concentrations and peaking at 93 MPa for 7% Bi whilst maintaining 10% elongation at fracture. X-ray diffraction and DSC thermal studies suggests that the solubility limit of Bi in -Sn (in the multicomponent SAC) is less than 2 wt% Bi. With the aid of small-angle neutron Scattering (SANS) and ultra-small-angle neutron scattering (USANS), it was found that the scattering intensity changes for alloys with Bi content in the range 0.8 – 1.5wt% compared to ternary SAC with less than 0.8% Bi at low scattering factors (Q > ) signifying microstructural differences at length scales of the order of 10–100 nm. There were no differences observed in scattering for alloy samples with more than 2 wt% Bi.<svg xmlns="http://www.w3.org/2000/svg" style="display: none;"><defs id="MathJax_SVG_glyphs"></defs></svg>

Low Melting Temperature Sn-Bi Solder: Effect of Alloying and Nanoparticle Addition on the Microstructural, Thermal, Interfacial Bonding, and Mechanical Characteristics

Solidification Behavior and Mechanical Properties of Sn-2.5Ag-0.8Cu-0.05Ni-1Bi and Sn-0.75Cu-0.065Ni-1.5Bi Solder Alloys, and Microstructures in Joints Formed Using Them

Low-temperature lead-free SnBiIn solder for electronic packaging

Thermal Property, Wettability and Interfacial Characterization of Novel Sn–Zn–Bi–In Alloys As Low-Temperature Lead-Free Solders

Effect of alloying elements on microstructural and electrical property in Sn–Cu–Bi lead-free solder alloys

Reducing anisotropy of rhombohedral Bi-rich phase for high-performance Ag-alloyed Sn–Bi low-temperature solders

Effect of Ni-CNTs on Microstructure, Thermodynamic Characteristic and Mechanical Properties of Sn58Bi-0.1Er Based Lead-Free Solder

Synthesis of Sn Nanoparticles and Their Size Effect on the Melting Point

The Effect of Bi Addition on the Electromigration Properties of Sn-3.0Ag-0.5Cu Lead-Free Solder

Effect of Ag, Ni and Bi Additions on Solderability of Lead-Free Solders

The effects of Bi substitution for Sn on mechanical properties of Sn-based lead-free solders

Microstructural Evolution and Mechanical Properties of Sn‐58Bi Solder Alloys with Different Cooling

Quaternary low melting point Sn-Bi-in-xGa solder with improved mechanical performance for advanced electronic packaging

Controllable fabrication of Sn–Bi alloy microspheres for improved lead-free solder

Effects of TiC nanoparticle addition on microstructures and mechanical properties of Sn-58Bi solder joints

Properties and Microstructures of Sn-Ag-Cu-X Lead-Free Solder Joints in Electronic Packaging

The Effect of In Concentration and Temperature on Dissolution and Precipitation in Sn–Bi Alloys

Comparison of high-speed shear properties of low-temperature Sn-Bi/Cu and Sn-In/Cu solder joints

Spreading Dynamics and Interfacial Characteristics of Sn-3.0Ag-0.5Cu-xBi Melting on Cu Substrates

Research Overview on the Electromigration Reliability of SnBi Solder Alloy

Effect of Graphene Nanosheets on the Microstructure and Mechanical Properties of Sn-20Bi Solder