Present status and prospects of nano-silver particles in the electronic field: a review
Jiayi Li,Shuai Zhang,Kyung-Wook Paik,Yew-Hoong Wong,Peng He,Shuye Zhang
DOI: https://doi.org/10.1080/01694243.2024.2408370
IF: 2.431
2024-10-02
Journal of Adhesion Science and Technology
Abstract:Compared with conventional solders, nano-silver benefits low-temperature sintering and high-temperature service, perfectly matching the high-temperature operating environment for third-generation semiconductor devices. However, the synthetic cost, complexity of the sintering process and the low connection strength limit its development. This paper describes the physical, chemical reduction and biological methods of synthesizing and compares the advantages and disadvantages of these three methods. The process parameters affecting the sintering process of silver nanoparticles (Ag NPs) are presented in a comprehensive and in-depth manner. Present methods are also introduced to improve the quality of nano-silver joints, such as the adding enhancement, the silver nanostructured films, and a trimodal-Ag paste consisting of silver particles in three sizes: nano, submicron and micron, aiming to break the limitation of the poor quality of nano-silver joints. In addition, this paper provides the first comprehensive summary of the sintering process and sintering mechanism of nano-silver, and introduces the latest results of the study of the sintering mechanism of nano-silver by using the Molecular Dynamics Simulation (MDS) technique. At the end, the advanced applications of nano-silver are shown, thus pointing out the direction for the further development and applications of nano-silver.
materials science, multidisciplinary,engineering, chemical,mechanics