Abstract:Silver dendrites were prepared by a facile replacement reaction between silver nitrate and zinc microparticles of 20 μm in size. The influence of reactant molar ratio, reaction solution volume, silver nitrate concentration, and reaction time on the morphology of dendrites was investigated systematically. It was found that uniform tree-like silver structures are synthesized under the optimal conditions. Their structure can be described as a trunk, symmetrical branches, and leaves, which length scales of 5–10, 1–2 μm, and 100–300 nm, respectively. All features were systematically characterized by scanning electron microscopy, transmission electron microscopy (TEM), high-resolution TEM, and x-ray powder diffraction. A hybrid fillers system using silver flakes and dendrites as electrically conductive adhesives (ECAs) exhibited excellent overall performance. This good conductivity can be attributed mainly to the synergy between the silver microflakes (5–20 μm sized irregular sheet structures) and dendrites, allowing more conductive pathways to be formed between the fillers. In order to further optimize the overall electrical conductivity, various mixtures of silver microflakes and silver dendrites were tested in ECAs, with results indicating that the highest conductivity was shown when the amounts of silver microflakes, silver dendrites and the polymer matrix were 69.4 wt.% (20.82 vol.%), 0.6 wt.% (0.18 vol.%), and 30.0 wt.% (79.00 vol.%), respectively. The corresponding mass ratio of silver flakes to silver dendrites was 347:3. The resistivity of ECAs reached as low as 1.7 × 10−4 Ω cm.

Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

Scalable Synthesis of Monodispersed Branched Submicron Silver Particles As the Printed Electrically Conductive Adhesives Fillers

The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Electrically conductive adhesives with sintered silver nanowires

Preparation and characterization of Ag conductive adhesive with low resistivity

Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection

Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

Scalable synthesis of the mono-dispersed silver micro-dendrites and their applications in the ultralow cost printed electrically conductive adhesives

The Studies on Surface Treatment of Silver Flakes for Application in Electrically Conductive Adhesives

Fabrication of Interconnected Silver Flakes for Conductive Adhesives Through Dopamine-Induced Surface Functionalization

Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

Preparation of MXene and its application in low temperature electrically conductive adhesive

Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive.

Microstructure Regulation and Fabrication of Epoxy-based Conductive Films with Excellent Electrical and Thermal Conductivity, Adhesion, Toughness, and Flexibility

In Situ Generation of Photosensitive Silver Halide for Improving the Conductivity of Electrically Conductive Adhesives.

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Advanced interconnect materials for ink-jet printing by low temperature sintering