Abstract:One of the largest obstacles for Ag based electrically conductive adhesives (ECAs), as an alternative for Pb-containing solders in electronic packaging, is that the conductivity of ECAs is lower than that of solders due to the limited physical contact area between/among conductive fillers and the insulated organic lubricant and metal oxide layers on the surface of the conductive fillers. What's more, the high cost of Ag fillers is also restricting the wide use of Ag based ECAs. In this study, Ag-coated-Cu flakes were chosen as a substitute for Ag flakes to reduce the cost. At the same time, the coating of Cu with an Ag layer could protect the Cu-based fillers from oxidation and corrosion. A mixture of weak reducing agents and substituting agents was selected to treat the Ag-coated-Cu flakes to increase the conductivity of the Ag-coated-Cu based ECAs. During the treatment process, the weak reducing agents can reduce the metal oxides on the filler surfaces, enabling more metallic contacts. Meanwhile, the substituting agents can partially remove or replace the long chain fatty acid lubricants on the metal flakes, improving the electron tunneling between/among neighboring flakes. As such, the multiple effects of the reducing agents and substituting agents can improve the conductivity of the ECAs. By using an appropriate amount of terephthalaldehyde and iodine treated Ag-coated-Cu flakes, the resistivity was reduced to as low as 1.28 x 10(-4) Omega cm for the ECA with 75 wt% content of treated fillers, which is comparable to that of commercially available Ag-filled ECAs (x10(-4) Omega cm). This work suggests that a surface chemical method can enhance the electrical conductivity of metal filler based ECAs.

The Studies on Surface Treatment of Silver Flakes for Application in Electrically Conductive Adhesives

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives

The Interaction Mechanism of Dicarboxylic Acids and Electrically Conductive Adhesives

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

Electrical Property of Electrically Conductive Adhesives Filled with Micro-Sized Ag Flakes and Modified by Dicarboxylic Acids

Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives

Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives

Sintering behavior and effect of silver nanoparticles on the resistivity of electrically conductive adhesives composed of silver flakes

Preparation of highly conductive adhesives by in situ generated and sintered silver nanoparticles during curing process

Simultaneously Improving Electrical Properties and Stabilizing Contact Resistance of Electrically Conductive Adhesives by Using Aminoaldehydes

Study of Surface Treatment of Copper Fillers for Improvement of Electrically Conductive Adhesives

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

Fabrication of Interconnected Silver Flakes for Conductive Adhesives Through Dopamine-Induced Surface Functionalization

Effects of Silver Nano-Particles and Nano-Wires on Properties of Electrically Conductive Adhesives

Conductivity Enhancement of Polymer Composites Using High-Temperature Short-Time Treated Silver Fillers

Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection