Abstract:One of the largest obstacles for Ag based electrically conductive adhesives (ECAs), as an alternative for Pb-containing solders in electronic packaging, is that the conductivity of ECAs is lower than that of solders due to the limited physical contact area between/among conductive fillers and the insulated organic lubricant and metal oxide layers on the surface of the conductive fillers. What's more, the high cost of Ag fillers is also restricting the wide use of Ag based ECAs. In this study, Ag-coated-Cu flakes were chosen as a substitute for Ag flakes to reduce the cost. At the same time, the coating of Cu with an Ag layer could protect the Cu-based fillers from oxidation and corrosion. A mixture of weak reducing agents and substituting agents was selected to treat the Ag-coated-Cu flakes to increase the conductivity of the Ag-coated-Cu based ECAs. During the treatment process, the weak reducing agents can reduce the metal oxides on the filler surfaces, enabling more metallic contacts. Meanwhile, the substituting agents can partially remove or replace the long chain fatty acid lubricants on the metal flakes, improving the electron tunneling between/among neighboring flakes. As such, the multiple effects of the reducing agents and substituting agents can improve the conductivity of the ECAs. By using an appropriate amount of terephthalaldehyde and iodine treated Ag-coated-Cu flakes, the resistivity was reduced to as low as 1.28 x 10(-4) Omega cm for the ECA with 75 wt% content of treated fillers, which is comparable to that of commercially available Ag-filled ECAs (x10(-4) Omega cm). This work suggests that a surface chemical method can enhance the electrical conductivity of metal filler based ECAs.

The Interaction Mechanism of Dicarboxylic Acids and Electrically Conductive Adhesives

The Studies on Surface Treatment of Silver Flakes for Application in Electrically Conductive Adhesives

Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

The Effect of Functionalized Silver on Rheological and Electrical Properties of Conductive Adhesives

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

In Situ Generation of Photosensitive Silver Halide for Improving the Conductivity of Electrically Conductive Adhesives.

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives

The Conduction Development Mechanism of Silicone-Based Electrically Conductive Adhesives

Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

Microstructure Regulation and Fabrication of Epoxy-based Conductive Films with Excellent Electrical and Thermal Conductivity, Adhesion, Toughness, and Flexibility

Electrochemical Performance of Electroactive Poly(Amic Acid)-Cu2+ Composites

Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive.

Electronic Interaction of Epoxy Resin with Copper at the Adhered Interface

Using Novel Materials to Enhance the Efficiency of Conductive Polymer

Progress in Research on Electrically Conductive Adhesives