Progress in Research on Electrically Conductive Adhesives

Tongxiang Liang

2002-01-01

Abstract:As one type of lead-free interconnect materials, ECA(Electrically Conductive Adhesives)has become an important area of research within the last few years. Conductive mechanism, components, and aging properties are key elements for the using of ECA. ACAs are ideal replacements of Pb/Sn interconnected materials.

What problem does this paper attempt to address?

Progress in polyacrylate‐based electrically conductive adhesives: Featured properties, preparation, applications, and perspectives

Fan Zhang,Nanlin Tang,Qingsong Jiang,Kailiang Qi,Xiang Zhu,Zilin Luo,Xiangyun Kong,Dongmian Zang,Hesheng Liu,Baizeng Fang

DOI: https://doi.org/10.1002/pc.28188

IF: 5.2

2024-02-08

Polymer Composites

Abstract:This review highlights the focal points in the properties, fabrications, and representative applications of polyacrylate‐based electrically conductive adhesives and proposes their challenges and perspectives. Polyacrylate‐based electrically conductive adhesives (PA‐based ECAs) have attracted much attention due to their wide applications in precise instruments and consumer electronics. To obtain high‐performance and environmentally friendly PA‐based ECAs, their main properties and corresponding mechanisms to performance, chemical constitutions and structure–function relationships should be well understood, and the applications of recent PA‐based ECAs should be comprehensively summarized. This review focuses on the progress of PA‐based ECAs in the past two decades and discusses the featured properties, preparation of PA, the selection of conductive fillers and the adhibition of the ECAs. The aim of the review is to find the challenges of high‐performance ECAs and offer some measures and foresee their future development. Highlights Preparation methods of polyacrylate (PA)‐based composites are presented. Properties of PA‐based electrically conductive adhesives (ECAs) are outlined. Selection of conductive fillers and the adhibition of ECAs are discussed. Representative applications of PA‐based ECAs are exhibited. Present main challenges and future solutions are highlighted.

materials science, composites,polymer science
Electrically Conductive Adhesives in Microelectronics Packaging

Mukund Ayalasomayajula,Mohit Ravi Khurana,Prince Shiva Chaudhary

DOI: https://doi.org/10.1115/1.4065939

2024-07-15

Journal of Electronic Packaging

Abstract:Abstract Electronic packaging is integral to safeguarding electronic devices while ensuring electrical connectivity and heat dissipation. This paper reviews electrically conductive adhesives (ECAs), focusing on two main types: isotropic conductive adhesives (ICAs) and anisotropic conductive adhesives (ACAs). ECAs offer advantages over traditional solders, including lower processing temperatures, environmental friendliness, and the ability to conform to flexible substrates. The paper explores the working mechanisms of ICAs and ACAs, highlighting their limitations and recent developments aimed at improvement. Key challenges for ICAs include low electrical conductivity and moisture absorption, while ACAs face limitations in fine-pitch applications and electric field-induced particle movement. Recent advancements discussed include the use of organic monolayers, nanofiber integration, magnetic self-assembly, low-temperature sintering of nano-silver particles, and copper nanoparticle fillers. These innovations hold promise for enhancing the electrical conductivity, mechanical strength, and reliability of ECAs. Finally, the paper explores applications of ECAs in die attach, flip-chip bonding, and chip-on-flex (COF) packaging, highlighting their potential for various electronic devices.

engineering, mechanical, electrical & electronic
Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

Qing Hua Li,Jian Hua Zhang

DOI: https://doi.org/10.4028/www.scientific.net/KEM.353-358.2879

2007-01-01

Key Engineering Materials

Abstract:Isotropic Conductive Adhesives (ICAs) were prepared using epoxy resin as matrix, latent curing agent as hardener, and silver particles as the conducting filler. The effects of nano-fillers (SiO2 nano-particles and carbon nanotubes) on the conductivity, adhension strength and reliability of ICAs were investigated experimentally in this paper. The results showed that these two nano fillers can improve both the conductivity and adhesion strength of ICAs, which maybe attributed to the nano-particles forming physico-chemical bonds with epoxy resin. These physico-chemical bonds increase the contact area and then minish the interspace of Ag particles, so it reduces electrical resistance and enables a high current flow. And the increasing contact area will improve the contact strength between Ag particles and epoxy resin. Under the reliability testing with the high temperature and high humidity (85 degrees C/85RH), the SiO2 nano-particles can improve the reliability of ICAs apparently, while carbon nanotubes can not. This is because insulating material can prevent silver migration.
Electrically conductive adhesives with sintered silver nanowires

Zhang Zhongxian,Chen Xiangyan,Yang Haowei,Fu Huiying,Xiao Fei

DOI: https://doi.org/10.1109/ICEPT.2009.5270629

2009-01-01

Abstract:Concerning the hazard to human and environment by lead, the lead-free solders and the electrically conductive adhesives (ECAs) have been considered as the most promising alternatives of the tin-lead solder. Electrically conductive adhesives offer numerous advantages compared to conventional solder technology such as environmental friendliness, mild processing conditions, low stress on the substrates, and fine pitch interconnect capability. It has received considerable attention in microelectronic packaging that the nano-size metal particles fuse at much lower temperature than the melting point of the bulk metal. The sintering of nano-size silver in ECAs can reduce the number of contact points between fillers and increase the conductivity of ECAs. The silver nanowires with a slenderness ratio of 50~60 were successfully synthesized through a polyol process and characterized by field emission scanning electron microscopy (SEM) in this paper. The silver nanowires began to sinter at 200degC and conductive adhesives filled with silver nanowires were studied.
In Situ Generation of Photosensitive Silver Halide for Improving the Conductivity of Electrically Conductive Adhesives.

Chaowei Li,Qiulong Li,Xiaoyang Long,Taotao Li,Jingxin Zhao,Kai Zhang,E. Songfeng,Jun Zhang,Zhuo Li,Yagang Yao

DOI: https://doi.org/10.1021/acsami.7b07045

IF: 9.5

2017-01-01

ACS Applied Materials & Interfaces

Abstract:Electrically conductive adhesives (ECAs) can be regarded as one of the most promising materials to replace tin/lead solder. However, relatively low conductivity seriously restricts their applications. In the present study, we develop an effective method to decrease the bulk electrical resistivity of ECAs. KI or KBr is added to replace the lubricant and silver oxide layers on silver flakes and to form photosensitive silver halide. After exposure to sunlight, silver halide can photodecompose into silver nanoparticles that will sinter and form metallic bonding between/among flakes during the curing process of ECAs, which would remarkably reduce the resistivity. The modified micro silver flakes play a crucial role in decreasing the electrical resistivity of the corresponding ECAs, exhibiting the lowest resistivity of 7.6 × 10-5 Ω·cm for 70 wt % loaded ECAs. The obtained ECAs can have wide applications in the electronics industry, where high conductance is required.
Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

chaowei li,xike gong,lei tang,kai zhang,jie luo,lin ling,jun pu,taotao li,mingxing li,yagang yao

DOI: https://doi.org/10.1039/c5tc00593k

IF: 6.4

2015-01-01

Journal of Materials Chemistry C

Abstract:One of the largest obstacles for Ag based electrically conductive adhesives (ECAs), as an alternative for Pb-containing solders in electronic packaging, is that the conductivity of ECAs is lower than that of solders due to the limited physical contact area between/among conductive fillers and the insulated organic lubricant and metal oxide layers on the surface of the conductive fillers. What's more, the high cost of Ag fillers is also restricting the wide use of Ag based ECAs. In this study, Ag-coated-Cu flakes were chosen as a substitute for Ag flakes to reduce the cost. At the same time, the coating of Cu with an Ag layer could protect the Cu-based fillers from oxidation and corrosion. A mixture of weak reducing agents and substituting agents was selected to treat the Ag-coated-Cu flakes to increase the conductivity of the Ag-coated-Cu based ECAs. During the treatment process, the weak reducing agents can reduce the metal oxides on the filler surfaces, enabling more metallic contacts. Meanwhile, the substituting agents can partially remove or replace the long chain fatty acid lubricants on the metal flakes, improving the electron tunneling between/among neighboring flakes. As such, the multiple effects of the reducing agents and substituting agents can improve the conductivity of the ECAs. By using an appropriate amount of terephthalaldehyde and iodine treated Ag-coated-Cu flakes, the resistivity was reduced to as low as 1.28 x 10(-4) Omega cm for the ECA with 75 wt% content of treated fillers, which is comparable to that of commercially available Ag-filled ECAs (x10(-4) Omega cm). This work suggests that a surface chemical method can enhance the electrical conductivity of metal filler based ECAs.
Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives

Ya Chen,Qiulong Li,Chaowei Li,Zhengfei Dai,Han Yan,Meng Zhu,Yongyi Zhang,Yagang Yao,Qingwen Li

DOI: https://doi.org/10.1016/j.compositesa.2020.106025

2020-01-01

Abstract:Electrically conductive adhesives (ECAs) are widely used in electronics and silver-based ECA is one of the most typical representatives. In this work, a trinary silver-based filler strategy was proposed to achieve ECAs with high conductivity and low silver content, where silver fractal flowers (Ag-FWs) were used to set up the conductive framework and silver nanowires (Ag-NWs) and silver nanoflakes (Ag-NFs) were added to connect the separated domains and fill the small gaps, respectively. The ECAs reached a low electrical resistivity of 6.0 x 10(-5) Omega cm and high adhesion strength of 13.5 MPa when the addition of Ag-FWs, Ag-NWs and Ag-NFs were 50 wt%, 7.5 wt % and 2.5 wt%, respectively, superior to those reported ECAs of 80 wt% silver loading. Besides, the ECA circuit fabricated by 3D printer demonstrated good electrical conductivity and resistance stability. The preparation idea of ECAs brings novel opportunities for the development of the electronic packaging industries.
A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

Shuye Zhang,Xiaoquan Qi,Ming Yang,Yang Cao,Tiesong Lin,Peng He,Kyung-Wook Paik

DOI: https://doi.org/10.1007/s10854-019-01246-8

2019-04-06

Abstract:Electrically conductive adhesives (ECAs) are mainly used in IC packaging, LED packaging and other electronic industry to replace the traditional soldering and lead-free solders, therefore, there is a constant need to improve the electrical conductive and mechanical property of ECAs. In this study, the electrical resistivity and shear strength of the modified nano-Ag coated Cu particles in ECA was investigated and compromised, in terms of filler contents, curing temperature and curing time. The conductive mechanism of the modified nano-Ag coated Cu particles in ECA was discussed as the filler content increased. Finally, the filler content was optimized by 23.5 vol% and 170 °C 100 min curing condition was selected to obtain the compromised property (5.159 × 10−6 Ω cm 6.121 MPa), which is better than the previous one (4.99 × 10−6 Ω cm, 4.406 MPa) at 200 °C. The tested data, as well as the failure mode and fracture interfaces, were carried out in this study.
Recent Progress in Conductive Adhesives

苏辉煌,钟新辉,詹国柱,余英丰

DOI: https://doi.org/10.3969/j.issn.1001-5922.2008.06.008

2008-01-01

Abstract:The mechanisms of conductivity of conductive adhesives were introduced,and possible methods for property improvement were also analyzed in this article.And it also gives a brief review of the influences of processes on conductivity,contact resistance stability and mechanical properties of isotropically conductive adhesives.
The Interaction Mechanism of Dicarboxylic Acids and Electrically Conductive Adhesives

CHEN Xiang-yan,ZHANG Zhong-xian,XIAO Fei

2011-01-01

Abstract:The conductivity of electrically conductive adhesives(ECAs) was improved by surface functionalizing silver flakes with dicarboxylic acids,or by directly adding dicarboxylic acids into ECA.The resistivity of ECAs was among(2-5)×10-5Ω·cm.Raman spectroscopy and X-ray photoelectron spectroscopy reveal that pentanedioic acid is chemically adsorbed onto the silver flake surface with monodentate bond.The differential scanning calorimetry(DSC) results show that pentanedioic acid can promote the curing reaction of epoxy in both processes,and thus increase the conductivity of ECAs.
Advanced interconnect materials for ink-jet printing by low temperature sintering

Rongwei Zhang,C. P. Wong

DOI: https://doi.org/10.1109/ectc.2009.5074008

2009-05-01

Abstract:In this study, we reported the development of a novel highly electrically conductive adhesive (ECA) that can be used in ink-jet printing and have the function of adhesive by a single step of low temperature sintering/curing. With the introduction of silver nanoparticles into the formulation, the electrical resistivity of the resulting ECAs is about $10^{-5}$ ohm.cm after sintering at 180°C or using a typical lead-free reflow profile (sintering/curing time: several minutes), which is compatible with industrial processis and favorable for the industrial applications. As is known, the strong adhesion of epoxy may enable the resulting ECA to be printed on various kinds of substrates, especially on flexible organic substrates, which is very promising for microelectronic applications. Moreover, the effects of time, temperature and the acid on the electrical resistivity of the ECA have been investigated, providing an in-depth understanding of the enhanced electrical properties. Finally, the contact resistance of the ECA on Cu surface can be stabilized for more than 1500 hrs. Thus the newly developed ECA can be ink-jettable, be compatible with industrial processes, has very low electrical resistivity by low temperature sintering/curing and could provide a strong adhesion to various substrates. The superior material properties of the formulated ECA combined with ink-jet printing technology will be very promising for a wide range of industrial applications in electronic industry.
Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

Hongru Ma,Zhuo Li,Xun Tian,Shaocun Yan,Zhe Li,Xuhong Guo,Yanqing Ma,Lei Ma

DOI: https://doi.org/10.1007/s11664-018-6145-5

IF: 2.1

2018-01-01

Journal of Electronic Materials

Abstract:Silver dendrites were prepared by a facile replacement reaction between silver nitrate and zinc microparticles of 20 μm in size. The influence of reactant molar ratio, reaction solution volume, silver nitrate concentration, and reaction time on the morphology of dendrites was investigated systematically. It was found that uniform tree-like silver structures are synthesized under the optimal conditions. Their structure can be described as a trunk, symmetrical branches, and leaves, which length scales of 5–10, 1–2 μm, and 100–300 nm, respectively. All features were systematically characterized by scanning electron microscopy, transmission electron microscopy (TEM), high-resolution TEM, and x-ray powder diffraction. A hybrid fillers system using silver flakes and dendrites as electrically conductive adhesives (ECAs) exhibited excellent overall performance. This good conductivity can be attributed mainly to the synergy between the silver microflakes (5–20 μm sized irregular sheet structures) and dendrites, allowing more conductive pathways to be formed between the fillers. In order to further optimize the overall electrical conductivity, various mixtures of silver microflakes and silver dendrites were tested in ECAs, with results indicating that the highest conductivity was shown when the amounts of silver microflakes, silver dendrites and the polymer matrix were 69.4 wt.% (20.82 vol.%), 0.6 wt.% (0.18 vol.%), and 30.0 wt.% (79.00 vol.%), respectively. The corresponding mass ratio of silver flakes to silver dendrites was 347:3. The resistivity of ECAs reached as low as 1.7 × 10−4 Ω cm.
Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

Xiao Min Zhang,Xiao-Li Yang,Bin Wang

DOI: https://doi.org/10.1016/j.ijadhadh.2020.102785

IF: 3.848

2021-03-01

International Journal of Adhesion and Adhesives

Abstract:<p>In order to enhance the oxidation resistance of a copper substrate, silver films were deposited by three-times electroless plating onto pure copper powders. Silver-coated copper (Ag/Cu) powders were introduced into electrically conductive adhesives (ECAs) as conductive fillers. The electrical conductivity of the ECAs can be increased by the inclusion of conductive fillers into the insulating resin matrix. The structures of the Ag/Cu powders and ECAs were characterized by scanning electron microscopy (SEM) and energy dispersive spectrometer (EDS), respectively. The morphology investigation showed that the silver coatings were compact and continuous. It was found that the ECAs can be solidified through chemical sintering in air at 150°C for 30min. The minimum volume resistivity was shown to reach<span class="math"><math>2×10-4Ω•cm</math></span>, suggesting excellent electrical conductivity, which makes us believe that the silver films have excellent oxidation resistance and could be broadly applied in the preparation of ECAs.</p>

materials science, multidisciplinary,engineering, chemical
Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives

Paulo E. Lopes,Duarte Moura,Loic Hilliou,Beate Krause,Petra Pötschke,Hugo Figueiredo,Ricardo Alves,Emmanuel Lepleux,Louis Pacheco,Maria C. Paiva

DOI: https://doi.org/10.3390/jcs4030105

2020-08-01

Journal of Composites Science

Abstract:The increasing complexity of printed circuit boards (PCBs) due to miniaturization, increased the density of electronic components, and demanding thermal management during the assembly triggered the research of innovative solder pastes and electrically conductive adhesives (ECAs). Current commercial ECAs are typically based on epoxy matrices with a high load (>60%) of silver particles, generally in the form of microflakes. The present work reports the production of ECAs based on epoxy/carbon nanomaterials using carbon nanotubes (single and multi-walled) and exfoliated graphite, as well as hybrid compositions, within a range of concentrations. The composites were tested for morphology (dispersion of the conductive nanomaterials), electrical and thermal conductivity, rheological characteristics and deposition on a test PCB. Finally, the ECA’s shelf life was assessed by mixing all the components and conductive nanomaterials, and evaluating the cure of the resin before and after freezing for a time range up to nine months. The ECAs produced could be stored at −18 °C without affecting the cure reaction.
High-performance conductive adhesives based on water-soluble resins for printed circuits, flexible conductive films, and electromagnetic interference shielding devices

Ge Cao,Shaoyong Cai,He Zhang,Yanqing Tian

DOI: https://doi.org/10.1007/s42114-021-00402-1

IF: 11.806

2022-01-21

Advanced Composites and Hybrid Materials

Abstract:Herein, we report high-performance electrically conductive adhesives (ECAs) as promising materials for flexible conductive films, printed circuits, and electromagnetic interference shielding devices. Through combining a small amount of water-dispersible polyaniline (PANI) nanorods and silver flakes into water-based polyurethane (WPU), the obtained ECAs showed high electrical conductivity with a low Ag content (4.8 × 10 4 S/cm, 60 wt% of silver, and 6% PANIs) and excellent stability; this stability withstood aging without change at 85 °C/65% RH for at least 20 days. Prototyped applications of the ECAs for flexible conductive films, printed circuits, and electromagnetic interference shielding devices were demonstrated. When these ECAs were used as flexible conductive films, these films exhibited excellent electrical performance under high mechanical deformation. The resistance of films remained unchanging after being bent with a 6-mm radius for over 8000 cycles, applied with 1000 kPa pressure, or stretched 20% for over 1000 cycles. The printed circuits had excellent flexibility and good adhesion on flexible substrates, enabling the circuits’ stable operation at a high deformation. Moreover, novel conductive foams with high conductivity of 283.4 S/m and reasonable electromagnetic interference shielding effectiveness (EMI SE) of above 34 dB were obtained by integrating the ECAs with PU sponges to broaden the applications of ECAs. Therefore, this study provided an original, uncomplicated, low-price route to fabricate high-performance ECAs based on water-soluble resins for various flexible electronic devices.Graphical abstract

nanoscience & nanotechnology,materials science, composites
Study of Surface Treatment of Copper Fillers for Improvement of Electrically Conductive Adhesives

Miao CHEN,Yunxia JIN,Tianke QI,Fei XIAO

DOI: https://doi.org/10.15943/j.cnki.fdxb-jns.2018.01.002

2018-01-01

Abstract:Easy oxidation of copper has been the major obstacle for its application in electrically conductive adhesives(ECAs).In this paper,the electrical performance of copper-filled ECA was improved by a simple surface treatment of copper fillers.The copper particles were treated with an ethanol solution of lactic acid and/or 3-diethylamino-1,2-propanediol (DEAPD).Thermal gravimetric analysis (TGA) showed that 0.4％～ 0.7％ volatilizable substances remained on the surface of copper fillers after treatment.FTIR revealed the adsorbed substances were copper lactate and/or DEAPD.Due to the antioxidation effect of the copper lactate and/or aminediol,the weight gain temperatures related to the oxidation of copper in TGA measurement were obviously elevated.And the resistivity of the copper filled ECA was greatly reduced after surface treatment(from (2.0±0.4) × 10-2 Ω · cm to (3.1±0.2)× 10-4 Ω · cm).Besides,the ECAs filled with surface-treated copper particles showed more stable electrical performance in a preliminary high temperature storage test.
The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

Z. X. Zhang,X. Y. Chen,F. Xiao

DOI: https://doi.org/10.1163/016942410x549924

IF: 2.431

2011-01-01

Journal of Adhesion Science and Technology

Abstract:Electrically conductive adhesives (ECAs) filled with sintered silver nanowires were prepared and the effect of different curing conditions on the electrical property of the ECAs was discussed. Silver nanowires with a diameter of 50-60 nm and a length of 2-3 mu m were successfully synthesized through a polyol process and surface functionalized with dicarboxylic acid. Morphology studies showed that surface modified silver nanowires began to sinter at 200 degrees C and became shorter and thicker, and eventually formed large chunks at higher temperatures. The conductive adhesives filled with 75 wt% of silver flakes and nanowires (3:2 weight ratio) were cured at different temperatures using two kinds of catalysts. The volume resistivity of the conductive adhesives cured at 300 degrees C without a catalyst reached 5.8 x 10(-6) Omega cm. The dramatic improvement in the conductivity of the ECA is due to the sintering of silver nanowires and the high solid content resulting from the partial evaporation of polymer components. (C) Koninklijke Brill NV, Leiden, 2011
Highly Conductive, Flexible, Polyurethane‐Based Adhesives for Flexible and Printed Electronics

zhuo li,rongwei zhang,kyoungsik moon,yan liu,kristen hansen,taoran le,c p wong

DOI: https://doi.org/10.1002/adfm.201202249

IF: 19

2013-01-01

Advanced Functional Materials

Abstract:Flexible interconnects are one of the key elements in realizing next-generation flexible electronics. While wire bonding interconnection materials are being deployed and discussed widely, adhesives to support flip-chip and surface-mount interconnections are less commonly used and reported. A polyurethane (PU)-based electrically conductive adhesive (ECA) is developed to meet all the requirements of flexible interconnects, including an ultralow bulk resistivity of approximate to 1.0 x 105 cm that is maintained during bending, rolling, and compressing, good adhesion to various flexible substrates, and facile processing. The PU-ECA enables various interconnection techniques in flexible and printed electronics: it can serve as a die-attach material for flip-chip, as vertical interconnect access (VIA)-filling and polymer bump materials for 3D integration, and as a conductive paste for wearable radio-frequency devices.
Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

Xiaomin Zhang

DOI: https://doi.org/10.1016/j.microrel.2023.114917

IF: 1.6

2023-02-01

Microelectronics Reliability

Abstract:Printable electrically conductive adhesive with high electrical conductivity and good mechanical properties has a broad application prospect in electronic devices. In order to explore the preparation method of high-purity nanometal conductive filler for conductive adhesive, silver nanopowders were prepared by DC arc plasma method. The silver nanopowders present a spherical structure and the average particle size is 55 nm. In this paper, a high performance electrically conductive adhesive (ECA) was prepared. This ECA was fabricated by mixing silver nanopowders with epoxy resin and screen-printed to a required shape. It was found that the ECA can be solidified through a low temperature sintering method in the air at 150 °C for 10 min. The electrical and mechanical properties of above ECA were investigated and characterized. The ECA filled with 75 % silver nanopowders exhibits excellent performances, including high electrical conductivity (9.8 × 10 −3 Ω·cm) and high bonding strength (8.3 MPa). Based on the performance characteristics, the ECA applications in flexible printed electrodes and interconnecting materials are demonstrated.

engineering, electrical & electronic,nanoscience & nanotechnology,physics, applied
Electrochemical Performance of Electroactive Poly(Amic Acid)-Cu2+ Composites

Ying Yan,Fangfei Li,Ashley M. Hanlon,Erik B. Berda,Xincai Liu,Ce Wang,Danming Chao

DOI: https://doi.org/10.1016/j.apsusc.2016.09.012

IF: 6.7

2017-01-01

Applied Surface Science

Abstract:Electroactive poly(amic acid)-Cu2+ (EPAA-Cu) composites on substrates were successfully prepared via nucleophilic polycondensation followed by the use of an immersing method. Analysis of the structure properties of EPAA-Cu composites was performed using scanning electron microscopy (SEM), X-ray photoelectron spectra (XPS) and Fourier-transform infrared spectra (FTIR). A significant current enhancement phenomenon of EPAA-Cu/ITO electrodes was found as evident from cyclic voltammetry (CV) measurements. In addition, Cu2+ ions were incorporated into the composites and had a positive effect on their electrochromic behaviors decreasing their switching times. The anticorrosive performance of EPAA-Cu composites coatings on the carbon steel in 3.5 wt%NaCl solution were also investigated in detail using tafel plots analysis and electrochemical impedance spectroscopy. The anticorrosive ability of these coatings significantly enhanced through the incorporation of Cu2+ ions. (C) 2016 Elsevier B.V. All rights reserved.

Progress in Research on Electrically Conductive Adhesives

Progress in polyacrylate‐based electrically conductive adhesives: Featured properties, preparation, applications, and perspectives

Electrically Conductive Adhesives in Microelectronics Packaging

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

Electrically conductive adhesives with sintered silver nanowires

In Situ Generation of Photosensitive Silver Halide for Improving the Conductivity of Electrically Conductive Adhesives.

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives

A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

Recent Progress in Conductive Adhesives

The Interaction Mechanism of Dicarboxylic Acids and Electrically Conductive Adhesives

Advanced interconnect materials for ink-jet printing by low temperature sintering

Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

Mixed Carbon Nanomaterial/Epoxy Resin for Electrically Conductive Adhesives

High-performance conductive adhesives based on water-soluble resins for printed circuits, flexible conductive films, and electromagnetic interference shielding devices

Study of Surface Treatment of Copper Fillers for Improvement of Electrically Conductive Adhesives

The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

Highly Conductive, Flexible, Polyurethane‐Based Adhesives for Flexible and Printed Electronics

Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

Electrochemical Performance of Electroactive Poly(Amic Acid)-Cu2+ Composites