Abstract:Printing of electrical circuits and interconnects using isotropic conductive adhesives (ICAs) is of great interest due to their low-temperature processing and compatibility with substrates for applications in sensors, healthcare, and flexible devices. As a lower cost alternative to silver (Ag), copper (Cu)-filled ICAs are desirable but limited by the formation of high-resistivity Cu surface oxides. To overcome this limitation, self-assembled monolayers (SAMs) of octadecanethiol (ODT) have been demonstrated to reduce the oxidation of micrometer-scale Cu powder particles for use in ICAs. However, the deposition and function of the SAM require further investigation, as described in this paper. As part of this work, the stages of the SAM deposition process, which included etching with hydrochloric acid to remove pre-existing oxides, were studied using X-ray photoelectron spectroscopy (XPS), which showed low levels of subsequent Cu oxidation when ODT coated. The treated Cu powders were combined with one- or two-part epoxy resins to make Cu-ICAs, and the effect of the Cu surface condition and weight loading on electrical conductivity was examined. When thermally cured in an inert argon atmosphere, ICAs filled with Cu protected by ODT achieved electrical conductivity up to 20 × 105 S·m-1, comparable to Ag-ICAs, and were used to make a functional circuit. To understand the function of the SAM in these Cu-ICAs, scanning and transmission electron microscopy were used to examine the internal micro- and nano-structures along with the elemental distribution at the interfaces within sections taken from cured samples. Sulfur (S), indicative of the ODT, was still detected at the internal polymer-metal interface after curing, and particle-to-particle contacts were also examined. XPS also identified S on the surface of cured Cu-ICAs even after thermal treatment. Based on the observations, electrical contact and conduction mechanisms for these Cu-filled ICAs are proposed and discussed.

Study of Surface Treatment of Copper Fillers for Improvement of Electrically Conductive Adhesives

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

Electrically conductive adhesives filled with surface modified copper particles

Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Effect of Ti3C2Tx/Ag MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives

Effect of Ti3C2Tx/Ag/MWCNTs/Ag MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives

Highly Conductive and Reliable Copper-Filled Isotropically Conductive Adhesives Using Organic Acids for Oxidation Prevention

The Role of Self-Assembled Monolayers in the Surface Modification and Interfacial Contact of Copper Fillers in Electrically Conductive Adhesives

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Surface Functionalization of Micrometer Silver Flakes for Fabricating High-Performance Electrically Conductive Adhesives

The Studies on Surface Treatment of Silver Flakes for Application in Electrically Conductive Adhesives

Conductivity Enhancement of Polymer Composites Using High-Temperature Short-Time Treated Silver Fillers

Electrochemical Performance of Electroactive Poly(Amic Acid)-Cu2+ Composites

Copper conductive adhesives for printed circuit interconnects

Copper Particles/epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin As Curing Agent

Study on the Anti-Oxidant Property of Copper Powder Coated Silane Coupling Agent in Isotropically Conductive Adhesives

Preparation of MXene and its application in low temperature electrically conductive adhesive

Fabrication of silver electrically conductive adhesive to apply in through-hole filling for PCB interconnection

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives