Abstract:Epoxy (EP) composites with comprehensive good processability, low coefficient of thermal expansion (CTE), and high thermal conductivity, but electrical insulation properties are largely demanded in the higher power electric devices. However, micro-fillers have a positive effect on maintaining the good flowability of epoxy composites, while do not bring high thermal conductivity enhancement per unit mass. While nano-fillers with high specific surfaces offer very promising opportunities for heat-conducting network construction, but the nano-fillers dispersion is difficult to control and will cause increased viscosity and processing difficulties. Herein, we expect that the addition of small amounts of silver nanowires (AgNWs) at 0.5 vol.% into the EP/S-Al2O3 composites could largely enhance the thermal conductivity but not sacrifice their processability. Owing to the bridging effects of rigid nanowires between the main spherical particles, the thermal conductivity of the micro-nano EP/AgNWs/S-Al2O3 composites with 40 vol.% S-Al2O3 and 0.5 vol.% AgNWs exhibits a 106.5% increment comparing to that without AgNWs. The limitation of both single micro or nano-sized thermal conductive fillers can be offset by the micro-nano filler network structure. The best combination properties of the EP/AgNWs/S-Al2O3 composites can reach the high thermal conductivity (1.602 W/m·K), low viscosity (55.6 Pa.s), low CTE (37.1 ppm/°C), and high glass transition temperature (Tg, 152.1°C). These results demonstrate that adding multiscale fillers into epoxy composites may solve the tradeoff between thermal conductivity and processability performances and fit the applications in high-power density electronic devices.

Conductivity Enhancement of Polymer Composites Using High-Temperature Short-Time Treated Silver Fillers

Effect of Thermal Annealing on the Electrical Conductivity of Copper-Tin Polymer Composites.

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Silver Pastes With Excellent Thermal Conductivity

Silver Surface Iodination for Enhancing the Conductivity of Conductive Composites

Using Novel Materials to Enhance the Efficiency of Conductive Polymer

In Situ Generation of Photosensitive Silver Halide for Improving the Conductivity of Electrically Conductive Adhesives.

Improvement in the Thermal Conductivity of Silver Epoxy Adhesive by Treating with Water Vapor

Achieving highly thermal conductivity of polymer composites by adding hybrid silver–carbon fiber fillers

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

Improvement of the thermal conductivity by surface iodination

The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Enhanced thermal conductivity of epoxy composites via bridged Al 2 O 3 network with in situ formed silver nanoparticles

Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability

A high-performance thermally conductive and electrically insulating silver@siloxane/graphene/epoxy composites at low filler content: Fabrication, mechanism study of insulation and thermal conductivity enhancement

Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive.