Abstract:Enormous efforts have been made towards the next generation of flexible, low-cost, environmentally benign printed electronics. In this regard, advanced materials for the printed conductive lines and interconnects are of significant importance. To improve efficiency and effectiveness, for several decades, conductive fillers have been filled into dispersants, which lead to the so-called electrically conductive composites (ECCs), which are a key material to the printed electronics varying from substituting the traditional solders to finding new applications in the blooming field of flexible printed electronics. ECCs in various formulations have converged in the current efforts to develop platforms with the desired specifications of electrical and thermal conductance, mechanical strength, and others. This platform is highly versatile and valuable for the emerging novel electronic devices, which emphasize tailoring processing conditions to cater to the key functional materials to optimize outcomes. The properties obtained can facilitate decisions about modifications to treatment. Noble metal fillers, such as silver flakes, have long been studied as active fillers for the ECCs. Owing to the recent progress in nanotechnology and surface modifications, many new avenues have opened for them. By taking advantage of the well-developed surface chemistry of these materials, researchers are enhancing their electrical conductivity, which is essential for broader applications. In recent years, the advances of ECCs have benefited the development of the applications of optoelectronics, e-papers, electromagnetic shielding, clinical diagnosis, radio frequency devices, etc. Despite the various advantages that they can offer over the traditional technologies, their limitations, e.g. low electrical conductivity, poor impact strength, increased contact resistance at elevated temperatures and humidity aging, have been considered as the major obstacles. In this feature article, we introduce the surface engineering techniques of the conductive filler materials that we and others have developed, with an emphasis on how these techniques influence the performance of the ECCs, especially for the improvement of the filler-to-filler electron transfer in the resin dispersants, some of which have potentially been approaching the theoretical upper limit of what they can reach in electrical conductivity. We and others have developed a set of chemical and engineering methods to modify the conductive fillers, enabling tailor-made surface functionalities and charges. These features, in turn, can be harnessed to adjust the electrical property and reliability of the ECCs, and further, to cater to various novel printed electronics, based on e.g. low temperature processing conditions.

Silver Surface Iodination for Enhancing the Conductivity of Conductive Composites

Conductivity Enhancement of Polymer Composites Using High-Temperature Short-Time Treated Silver Fillers

Improvement of the thermal conductivity by surface iodination

Using Novel Materials to Enhance the Efficiency of Conductive Polymer

Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Surface Iodination: A Simple and Efficient Protocol to Improve the Isotropically Thermal Conductivity of Silver-Epoxy Pastes

Synthesis of Highly Conductive, Uniformly Silver-Coated Carbon Nanofibers by Electroless Deposition

Surface Treatment of Micron Silver Flakes with Coupling Agents for High-Performance Electrically Conductive Adhesives

Scalable synthesis of the mono-dispersed silver micro-dendrites and their applications in the ultralow cost printed electrically conductive adhesives

The synergistic effect of micron spherical and flaky silver-coated copper for conductive adhesives to achieve high electrical conductivity with low percolation threshold

The Studies on Surface Treatment of Silver Flakes for Application in Electrically Conductive Adhesives

Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

A Silver Modified Nanosheet Self-Assembled Hollow Microsphere with Enhanced Conductivity and Permeability

Facile preparation of high conductive silver electrodes by dip-coating followed by quick sintering.

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Fabrication of Interconnected Silver Flakes for Conductive Adhesives Through Dopamine-Induced Surface Functionalization

Printed electrically conductive composites: conductive filler designs and surface engineering

Preparation of Electrically Conductive Polyimide/Silver Composite Fibers Via In-Situ Surface Treatment

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives