Novel cocklebur-like nano silver oxide for low-temperature curing pastes with dense conductive paths
Chunmei Li,Ying Sun,Miao Sun,Baoping Lin,Xueqin Zhang
DOI: https://doi.org/10.1007/s10854-023-11260-6
2023-09-26
Journal of Materials Science Materials in Electronics
Abstract:Conductive silver paste, as the key component for various electronic devices, consists of silver filler, binder, solvent and additive. The rising demand of flexible electronics stimulates the development of low-temperature curing pastes. However, creating a fully conductive channel between the silver powders is very challenging due to its poor dispersion and weak interconnection properties. The trade-off between high electrical conductivity and low sintering temperature is major issue to be resolved. To achieve the low temperature sintering between silver particles, partly replacement of silver with Ag 2 O may become an implementable solution as the self-reduction of Ag 2 O can yield silver nanoparticle and hence connect the conductive silver pathway. Herein, a novel cocklebur Ag 2 O is prepared and applied to the silver pastes. The unique morphology of the Ag 2 O is characterized as the aggregate of nano-particles (10–30 nm) and presence of small bulges on the surface, which can aid to obtain the low temperature reduction of Ag 2 O and hence improve the interconnection with silver. The influences of the synthetic temperature, molar ratio of reactants and surfactant on the morphology have been investigated in details. And thermal analysis indicates that the Ag 2 O particles can be self-reduced under a low temperature of approximately 160 °C. Scanning electron microscope images show an interconnected and fully cured morphology of the paste film with the synthesized Ag 2 O particles. Moreover, as the cocklebur Ag 2 O based paste has been applied to flexible electrode, outstanding properties of great adhesion, hardness, and bending durability could be observed, indicating its promising potential in the field of flexible electronics.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied