Abstract:Attachment of semiconductor devices to a package substrate is essential for providing electrical and structural connections as well as a heat dissipation path. The die-attach materials play a vital role in ensuring the system performance and reliability. As the electronics industry continues to integrate more functions in smaller packages, the electrical, thermal and mechanical properties of the existing die-attach materials such as solders and conductive epoxies fail to meet more demanding requirements for performance and reliability. To address this problem, we developed low-temperature sintered nanosilver as a new die-attaching material. Experimental results of the electrical, thermal, and mechanical properties of the sintered silver die-attachment are presented in this paper. The nanoscale silver paste was made by dispersing 30-nm silver powder under ultrasonic agitation in an organic binder system. The electrical resistivity, obtained from screen printed resistor patterns on an insulate substrate that were sintered at 280degC for around 10 minutes in air, was found to be 2.6 times 10 5 (Omegamiddotcm)-1. The thermal conductivity was obtained by the laser flash method and was found to be 240 W/K-m. Both values are lower than those of bulk silver because the sintered silver had a density around 80%. The coefficient of thermal expansion (CTE) of the sintered silver was measured by dilatometry and was found to be 19 times 10-6/degC, nearly identical to that of bulk silver. The apparent elastic modulus of the sintered silver was found to be 9 GPa while the yield strength was around 43 MPa. Furthermore, die-shear tests on devices bonded by the sintered silver gave strength of around 21 MPa for a gold-metallized substrate and strength of 38 MPa for a silver-metallized substrate. These results demonstrate that the nanoscale silver paste sintered at low temperature is an excellent alternative to solders or epoxies for die attachment

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Preparation of conductive silver paste using bimodal particles

Preparation of Low Volatile Organic Compounds Silver Paste Containing Ternary Conductive Fillers and Optimization of Their Performances

Optimizing Silver Paste Conductivity with Controlled Convection for Nanowrinkle Growth

Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

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Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste

High electrical conductivity and bending resistance of Ag NPs/Ag Flakes composite silver paste are achieved by sintering Ag NPs

Hybrid silver pastes with synergistic effect of multi-scale silver fillers and the application in flexible circuits

Physical Properties of Paste Synthesized from Wet- and Dry-Processed Silver Powders

Preparation of Nanoparticle and Nanowire Mixed Pastes and Their Low Temperature Sintering

Study on the preparation process and sintering performance of doped nano-silver paste

Investigation of 1-hexanol base silver paste formula for low-temperature sintering

Low temperature-cured electrically conductive pastes for interconnection on electronic devices

Preparation of Micron-Sized Plate-Like Silver Powders Used in Silver Paste by Wet-Chemical Reduction Method

Effects of organic additives on the microstructural, rheological and electrical properties of silver paste for LTCC applications

Novel cocklebur-like nano silver oxide for low-temperature curing pastes with dense conductive paths

Characterization of Low-Temperature Sintered Nanoscale Silver Paste for Attaching Semiconductor Devices

Study on the mechanism of forming silver nanoparticles on micron-scale flake silver powder