Abstract:Abstract Due to the high conductivity and stability of silver, silver ink has been widely used in the field of printed electronics. However, since mechanical strain would cause the contact between key particles to be broken. Recently, higher requirements have been put on the bending resistance of silver paste. In this experiment, by preparing Ag NPs: Ag Flakes composite materials of 20:80 and 30:70 respectively, a new method for preparing stable modified flake silver powder is proposed, and the attachment and growth methods of Ag NPs reduced on micron flake silver powder is discussed. Flake silver powder, dispersant and reducing agent are added to the silver-ammonia complex, and the nano-silver particles are reduced on the flake silver powder by controlling the reaction conditions. When Ag + : Ag Flakes in the solution is 30:70, there is a clear interface between the silver particles and the silver flakes, and the size distribution range is between 10 and 100 nm; when Ag + : Ag Flakes is 20:80, the distance between the nano-silver particles and the silver plate crystal plane is about 0.222 nm and 0.260 nm, these spacings represent the (1–12) and (004) planes of Ag, respectively. The reduced silver particles grow on the surface of the silver sheet, the size is about 5 ∼ 60 nm, and form a sheet-point combination of shaped silver powder, which can be used to make conductive silver paste with cost and performance competitiveness. The reaction can be completed at room temperature (5 ∼ 25 °C) and atmospheric pressure (80 ∼ 100 kPa), the operation is simple, the reaction time is short, and it has a positive effect on the commercial production of printable highly conductive silver paste.

Preparation of Micron-Sized Plate-Like Silver Powders Used in Silver Paste by Wet-Chemical Reduction Method

Preparation of Micro-Size Spherical Silver Particles and Their Application in Conductive Silver Paste

Synthesis of monodispersed plate-shaped silver particles: with high tap-density and low radius-thickness ratio

Study on the mechanism of forming silver nanoparticles on micron-scale flake silver powder

Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Optimizing Silver Paste Conductivity with Controlled Convection for Nanowrinkle Growth

Preparation of conductive silver paste using bimodal particles

Preparation and Characterization of Silver Powders with Spheric Shape and Different Sizes

Tuning the electrical resistivity of conductive silver paste prepared by blending multi-morphologies and micro-nanometers silver powder

Preparation of Low Volatile Organic Compounds Silver Paste Containing Ternary Conductive Fillers and Optimization of Their Performances

Preparation of nano silver pastes applied in printed electronics

Synthesis and formation mechanism of micron-size silver flakes with high radius-thickness ratio: application to silver paste

Facile preparation of high conductive silver electrodes by dip-coating followed by quick sintering.

Preparation of Sub-micron Spherical Silver Powders for Solar Cell Paste

One Step Synthesis of Silver Nanowires Used in Preparation of Conductive Silver Paste

The Preparation of Silver-Coated Nickel Powders Via Electroless Plating

Preparation and Microstructure of Silver Nanopowder with Spheric Morphology

Physical Properties of Paste Synthesized from Wet- and Dry-Processed Silver Powders

Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

Preparation of Superfine Spherical Silver Powders for Solar Cell Silver Paste Via Non-wetting Effect of the Liquid/Solid Interface

Preparation Methods and Development Tendency of Ultrafine Nickel Powder Applicated in Conductive Pastes