Abstract:Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × 10−6 Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance.

Facile preparation of high conductive silver electrodes by dip-coating followed by quick sintering.

Facile preparation of patterned silver electrodes with high conductivity, flatness and adjustable work function by laser direct writing followed by transfer process

Synthesis of 10nm Ag nanoparticle polymer composite pastes for low temperature production of high conductivity films

Facile synthesis of monodisperse silver nanoparticles for screen printing conductive inks

Annealing-free, flexible silver nanowire-polymer composite electrodes via a continuous two-step spray-coating method

Facile preparation of stable reactive silver ink for highly conductive and flexible electrodes

Facile synthesis of low temperature sintering Ag nanopaticles for printed flexible electronics

A simple, low-cost approach to prepare flexible highly conductive polymer composites by in situ reduction of silver carboxylate for flexible electronic applications

A Facile Method for Preparing the Spherical Silver Particles Used for Solar Cells

Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Selective Patterning of Conductive Silver on Polyimide Film by Localized Microplasma Reduction and Electroless Deposition

Preparation of Silver Nanosheets Used for Low Temperature Bonding

Preparation of Micron-Sized Plate-Like Silver Powders Used in Silver Paste by Wet-Chemical Reduction Method

High Yield Preparation of Silver Nanowires by CuCl2-mediated Polyol Method and Application in Semitransparent Conduction Electrode

Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

Fast and low-temperature sintering of silver complex using oximes as a potential reducing agent for solution-processible, highly conductive electrodes

Facile preparation of particle-free hybrid amine silver ink with synergistic effect for low-resistivity flexible films

One-step Synthesis of Ag Nanoparticles for Fabricating Highly Conductive Patterns Using Infrared Sintering

Preparation Of High-Performance Conductive Ink With Silver Nanoparticles And Nanoplates For Fabricating Conductive Films

Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

A new approach of printing conductive patterns with sliver nanoparticles without sintering