Abstract:Abstract Silver particle-free inks are under rapid development due to their unique properties. Currently, most of the developed silver particle-free inks contain multiple components. In addition to the necessary solvents and silver precursors, these inks also contain complexing agents, reducing agents, and various additives. While such complex compositions assure good stability and printability of the inks, they hamper the sintering process as excess time and energy are often required to remove residues from various compositions to ensure high conductivities of the printed structures. Thus, a simple ink system is expected. On the other hand, plasma sintering shows its sintering potential in treating silver particle-free inks, but is only employed for the sintering of silver nitrate or silver acetate-based inks. Consequently, developing new particle-free ink systems with simple compositions and exploring the potential of plasma sintering is very meaningful. In this work, a clear and transparent silver particle-free ink was formulated, which can be treated both by low-pressure argon plasma sintering and low-temperature thermal sintering (120–160 °C). The roles of 2-amino-2-methyl-1-propanol (AMP) in the ink formulation were investigated in detail, which not only acts as the solvent but also as the complexing agent for silver oxalate to lower the sintering temperature of the ink. The electrical performance of the formulated ink was examined for both sintering processes for different conditions. The thermal sintering resulted in a resistivity value of 24.3 μΩ·cm on glass substrates after treatment at 160 °C for 60 min, while the plasma sintering yielded a resistivity value of 29 μΩ·cm at 500 W for 30 min. Compared to thermal sintering, plasma sintering achieved a similar electrical performance, but with a more nonuniform film structure. The power, sintering time, and the pressure of argon are key factors responsible for the conductivity of the produced films. Nevertheless, both resistivity values do meet the minimal electrical requirements of most electronic applications.

Fast and low-temperature sintering of silver complex using oximes as a potential reducing agent for solution-processible, highly conductive electrodes

Effects of Solvent Type on Low-Temperature Sintering of Silver Oxide Paste to Form Electrically Conductive Silver Film

Facile preparation of high conductive silver electrodes by dip-coating followed by quick sintering.

An conductive ink based on silver oxide complex for low-temperature sintering with dense conductive paths

Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

Facile preparation of particle-free hybrid amine silver ink with synergistic effect for low-resistivity flexible films

Facile synthesis of low temperature sintering Ag nanopaticles for printed flexible electronics

Low-temperature reducible particle-free screen-printable silver ink for the fabrication of high conductive electrodes

A simple, low-cost approach to prepare flexible highly conductive polymer composites by in situ reduction of silver carboxylate for flexible electronic applications

Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Investigation of 1-hexanol base silver paste formula for low-temperature sintering

Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates

Low-temperature sintering of silver patterns on polyimide substrate printed with particle-free ink

Effects of amine types on the properties of silver oxalate ink and the associated film morphology

Recyclability‐by‐design of Printed Electronics by Low‐Temperature Sintering of Silver Microparticles

Comparing low-temperature thermal and plasma sintering processes of a tailored silver particle-free ink

Room Temperature Electronic Functionalization of Thermally Sensitive Substrates by Inkjet Printing of a Reactive Silver‐Based MOD Ink

An organic silver complex conductive ink using both decomposition and self-reduction mechanisms in film formation

Facile synthesis of monodisperse silver nanoparticles for screen printing conductive inks

One step preparation of copper–silver self-catalyzed hybrid conductive ink with reduced sintering temperature for flexible electronics