Abstract:This study provides a synthetic route to a novel silver‐based metal‐organic decomposition (MOD) ink which is used to form highly conductive silver films on highly thermally sensitive skin‐inspired silk/epoxy composite substrates by directly inkjet printing and sintering at room temperature with no change to superior mechanical properties of the composite. The developments in inkjet printing technology and the printed electronics industry in the past two decades have provided cost‐effective, environment‐friendly, and reliable alternates to traditional methods of fabricating electrical devices. However, most commercial metallic inks require high sintering temperatures to form desired functional patterns, which limits the applications of printed electronics in scenarios that require electrical devices on thermally sensitive substrates, like biomaterials or bio‐synthetic composite materials. This study has provided the synthetic route of a novel silver‐based metal organic decomposition (MOD) ink which has been used to form highly conductive silver films on the thermally sensitive skin‐inspired silk/epoxy composite substrates by directly inkjet printing with accurate pattern control, whilst self‐decomposing and sintering at room temperature. The fabricated silver patterns on the thermally sensitive silk/epoxy composite substrate were highly conductive with conductivity of 4.65 × 104 S m−1. These silver patterns also showed impressive malleability as bulk silver films, which could be further developed into motion sensors for wearable devices or medical applications. Our strategy provides a general platform for electronic functionalization without temperature constraints. The particle‐free, reactive silver‐precursor, and lower sintering temperature of the ink also widen the choices of substrates, as exemplified herein with outstanding printing quality and high electrical conductivity (1.20 × 106 S m−1) also achieved on paper.

Low-temperature reducible particle-free screen-printable silver ink for the fabrication of high conductive electrodes

Facile synthesis of monodisperse silver nanoparticles for screen printing conductive inks

Facile synthesis of silver malonate conductive MOD ink for screen printing

Direct Writing Highly Conductive Silver Pattern on Flexible Substrate Based on Particle-Free and Ionic Liquid-Assisted Ink

Preparation of low-temperature sintered high conductivity inks based on nanosilver self-assembled on surface of graphene

Development of Silver Nanoparticle Ink for Printed Electronics

Facile preparation of particle-free hybrid amine silver ink with synergistic effect for low-resistivity flexible films

A Simple Strategy towards Highly Conductive Silver‐Nanowire Inks for Screen‐Printed Flexible Transparent Conductive Films and Wearable Energy‐Storage Devices

Synthesis of monodisperse silver nanoparticles for ink-jet printed flexible electronics

Green Approach to Prepare Silver Nanoink with Potentially High Conductivity for Printed Electronics

Highly conductive films sintered by Au–Ag nanoparticles ink at low temperature

An conductive ink based on silver oxide complex for low-temperature sintering with dense conductive paths

Low-temperature sintering of silver patterns on polyimide substrate printed with particle-free ink

Facile synthesis of low temperature sintering Ag nanopaticles for printed flexible electronics

Low-temperature silver-based ink for highly conductive paths through industrial printing processes suitable for thermally sensitive substrates and beyond

Reactive Silver Oxalate Ink Composition with Enhanced Curing Conditions for Flexible Substrates

Green Synthesis of Micron-Sized Silver Flakes and Their Application in Conductive Ink

Electrical conductivity of silver conductive ink synthesized using chemical reduction method

Room Temperature Electronic Functionalization of Thermally Sensitive Substrates by Inkjet Printing of a Reactive Silver‐Based MOD Ink

Flash Light Sintering of Silver Nanoink for Inkjet-Printed Thin-Film Transistor on Flexible Substrate

Silver content effect on rheological and electrical properties of silver pastes