Abstract:Abstract Silver particle-free inks are under rapid development due to their unique properties. Currently, most of the developed silver particle-free inks contain multiple components. In addition to the necessary solvents and silver precursors, these inks also contain complexing agents, reducing agents, and various additives. While such complex compositions assure good stability and printability of the inks, they hamper the sintering process as excess time and energy are often required to remove residues from various compositions to ensure high conductivities of the printed structures. Thus, a simple ink system is expected. On the other hand, plasma sintering shows its sintering potential in treating silver particle-free inks, but is only employed for the sintering of silver nitrate or silver acetate-based inks. Consequently, developing new particle-free ink systems with simple compositions and exploring the potential of plasma sintering is very meaningful. In this work, a clear and transparent silver particle-free ink was formulated, which can be treated both by low-pressure argon plasma sintering and low-temperature thermal sintering (120–160 °C). The roles of 2-amino-2-methyl-1-propanol (AMP) in the ink formulation were investigated in detail, which not only acts as the solvent but also as the complexing agent for silver oxalate to lower the sintering temperature of the ink. The electrical performance of the formulated ink was examined for both sintering processes for different conditions. The thermal sintering resulted in a resistivity value of 24.3 μΩ·cm on glass substrates after treatment at 160 °C for 60 min, while the plasma sintering yielded a resistivity value of 29 μΩ·cm at 500 W for 30 min. Compared to thermal sintering, plasma sintering achieved a similar electrical performance, but with a more nonuniform film structure. The power, sintering time, and the pressure of argon are key factors responsible for the conductivity of the produced films. Nevertheless, both resistivity values do meet the minimal electrical requirements of most electronic applications.

Low-temperature sintering of silver patterns on polyimide substrate printed with particle-free ink

Direct Writing Highly Conductive Silver Pattern on Flexible Substrate Based on Particle-Free and Ionic Liquid-Assisted Ink

Parametric study on conductive patterns by low-temperature sintering of micron silver ink

An conductive ink based on silver oxide complex for low-temperature sintering with dense conductive paths

Comparing low-temperature thermal and plasma sintering processes of a tailored silver particle-free ink

Facile preparation of particle-free hybrid amine silver ink with synergistic effect for low-resistivity flexible films

Fabrication of Polymer Silver Conductor Using Inkjet Printing and Low Temperature Sintering Process

Facile synthesis of low temperature sintering Ag nanopaticles for printed flexible electronics

A Promising Approach to Conductive Patterns with High Efficiency for Flexible Electronics

Facile synthesis of monodisperse silver nanoparticles for screen printing conductive inks

High-reproducibility, Flexible Conductive Patterns Fabricated with Silver Nanowire by Drop or Fit-to-flow Method

Inkjet Printing of Polyacrylic Acid-Coated Silver Nanoparticle Ink onto Paper with Sub-100 Micron Pixel Size

Conductivity enhancement of Ag nanowire ink by decorating in situ formed Ag particles under low-temperature sintering

Low-temperature silver-based ink for highly conductive paths through industrial printing processes suitable for thermally sensitive substrates and beyond

Preparation of low-temperature sintered high conductivity inks based on nanosilver self-assembled on surface of graphene

Green Approach to Prepare Silver Nanoink with Potentially High Conductivity for Printed Electronics

Silver Nanoparticles Based Ink with Moderate Sintering in Flexible and Printed Electronics

One-step Synthesis of Ag Nanoparticles for Fabricating Highly Conductive Patterns Using Infrared Sintering

Design and Synthesis of Functional Silane-Based Silicone Resin and Application in Low-Temperature Curing Silver Conductive Inks

Fabrication of paper-based conductive patterns for flexible electronics by direct-writing

Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics