Parametric study on conductive patterns by low-temperature sintering of micron silver ink

Man Zhao,Gongwen Tang,Shuai Yang,Shancan Fu

DOI: https://doi.org/10.1039/d2ra07889a

IF: 4.036

2023-01-01

RSC Advances

Abstract:The fabrication of dense conductive patterns was achieved by low-temperature sintering of 1–3 μm micron silver flakes with the help of the addition of a small amount of nanosilver particles.

chemistry, multidisciplinary

What problem does this paper attempt to address?

Low-temperature sintering of silver patterns on polyimide substrate printed with particle-free ink

Ning Wang,Yangai Liu,Wei Guo,Chao Jin,Lefu Mei,Peng Peng

DOI: https://doi.org/10.1088/1361-6528/ab85ef

IF: 3.5

2020-05-12

Nanotechnology

Abstract:In this study, a transparent particle-free reactive silver ink was used to fabricate conductive patterns on flexible substrate. Thermal annealing and plasma irradiation at low temperature were utilized to improve the conductivity of as-printed patterns. The effects of sintering process parameters on the microstructure and resistivity of patterns were investigated. Under the optimized process conditions, the resistivity of pattern reached 1.2 ×10 -7 Ω · m by thermal sintering, while it was 8 ×10 -8 Ω · m after plasma sintering. Combined with these two sintering techniques, the resistivity was reduced to 6 × 10 -8 Ω · m, close to that of bulk silver. This work provides an alternative solution for fabricating of highly conductive feature patterns on common flexible substrates.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology
Preparation of Nano-Silver Conductive Ink and Electrode Properties

Shi Keying,Song Yanlin,Wang Shuo,Zhang Xingye,Kang Jiameng

Abstract:In this work, silver nanoparticles with the size in the range of 30 nm to50 nm were prepared by chemical reduction method using silver nitrate, adipic dihydrazide and dextrose as the main raw materials. Nano-silver conductive inks were prepared by dispersing nano-silver particles in a specific proportion mixed solvent. Secondly, the nano-silver conductive ink was patterned by inkjet printing, and the morphology and conductivity of the nano-silver were studied. The effects of sintering temperature and sintering time on the resistivity of the inkjet printed electrodes were studied. The results showed that lower resistivity, the value was 0.34 mΩ·cm, could be obtained with sintering temperature raised up to 200°C, and the sintering time kept for 40 min.

Engineering,Chemistry,Materials Science
An conductive ink based on silver oxide complex for low-temperature sintering with dense conductive paths

Miao Sun,Chunmei Li,Yuqing Xu,Baoping Lin,Xueqin Zhang,Ying Sun

DOI: https://doi.org/10.1007/s10854-024-12524-5

2024-04-13

Journal of Materials Science Materials in Electronics

Abstract:In the context of advancing flexible electronic technologies, conductive ink has garnered significant scholarly interest. Wherein, metal-organic decomposition (MOD) ink composed of silver precursors, complexing agents, and volatile organic solvents, has been widely studied due to its advantages such as simple preparation, long shelf life, high jetting stability, and low-temperature processing. However, the volumetric reduction of MOD ink frequently surpasses 80%, which typically could lead to multiple voids and breaks in the conductive film, resulting in poor conductivity. Meanwhile, a high temperature of above 180 °C is usually required for the MOD ink to be converted into conductive film. Nevertheless, it is imperative for the ink to be deposited onto substrates at low temperatures. Herein, a low temperature conducting ink with multiple silver source precursors has been developed. The results show that after sintering at 100 °C for 40 min on a polyimide (PI) substrate, the resistivity of the silver film was 16.8 μ Ω cm, which is only ten times higher than that of bulk silver, and the silver film with good uniformity and conductivity can be formed. Defects, such as voids and cracks, are significantly reduced through the gradient decomposition of different silver source during the sintering process. The formula of ink and the effects of sintering temperature on the microstructure and electrical properties of silver ink thin films have been studied in details using XRD, SEM, EDX, and four-probe techniques.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Fabrication of Polymer Silver Conductor Using Inkjet Printing and Low Temperature Sintering Process

S.P. Wu,K. C. Yung,L.H. Xu,X. H. Ding,S. P. Wu,L. H. Xu

DOI: https://doi.org/10.1109/tepm.2008.2004554

2008-10-01

IEEE Transactions on Electronics Packaging Manufacturing

Abstract:In this paper, silver powders with a uniform particle size of $0.2-0.4\ \mu \text{m}$ and an excellent dispersibility were applied to produce a conductive ink for the inkjet printing process. The thermal behaviors of silver particles sintered at different temperature were investigated through X-ray diffraction (XRD) patterns. It was found out that both the particle size and crystal grains increase during the surface diffusion and sintering process. A drop-on-demand (DOD) inkjet printing system was employed to print the conductor by using as-mentioned silver particles suspended in terpineol/poly ketone (P K) system as conductive materials. The optimized value of $W_{PK}/W_{\text{silver}}$ was 5 %, corresponding to a resistivity of $2.0\ \mu\Omega$ cm, It was revealed that an increase in the $W_{PK}/W_{\text{silver}}$ ratio resulted in the increase in both the resisitivity and adhesion strength of the conductor. The scanning electron microscopy (SEM) analysis based on the microstructures of silver conductor further illustrates that the densification of conductor and long-range interparticle connectivity ensure the silver conductor a low resistivity. The adhesiveness effect from PK resin enables the conductor a high adhesion strength.
Direct pen writing and atomic-scale molecular dynamics simulation study of a novel silver nano-ink

Longchao Zhuo,Qinghao Wang,Jiacheng Sun,Yaoyao Feng,Enhuai Yin,Wen Liu,Bingqing Chen,Samuel Lin,Qiqi Zhang

DOI: https://doi.org/10.1007/s10854-023-11628-8

2023-11-19

Journal of Materials Science Materials in Electronics

Abstract:Herein, a facile synthesis approach for silver nanoparticles is disclosed through reduction action without the need for a peristaltic pump or inert gas shielding has been disclosed. Subsequent electron microscopy, X-ray diffraction, Ultraviolet–Visible spectroscopy and Fourier transform infrared spectroscopy were conducted to characterize the optimized nanoparticles with an average grain size of 29.9 nm. Employing a designed ink containing 35 wt% silver, four types of inks by direct writing showed different printability on the glass surface and conductive behavior. A resistivity value as low as 4.7 × 10 −7 Ω m was achieved following basic traditional sintering process at 250 °C for 30 min, along with stable electrical conductivity under repeated bending, suitable for bending in flexible electronic devices. Finally, molecular dynamics simulation was applied to gain a deeper understanding of the melting and sintering processes of Ag nanoparticles during the atomic-level bonding.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Preparation of low-temperature sintered high conductivity inks based on nanosilver self-assembled on surface of graphene

Piao Liu,Wen-qiang He,An-xian Lu

DOI: https://doi.org/10.1007/s11771-019-4227-z

2019-11-01

Journal of Central South University

Abstract:Finer nanoplates of silver are prepared by self-assembly on the surface of graphene, and the low-temperature sintered high conductivity ink containing the silver nanoplates is prepared. Most importantly, graphene is added to the solution before the chemical reduction reaction occurs. Firstly, it is found that silver nanoplates have self-assembly phenomenon on the surface of graphene. Secondly, the Ag nano hexagonal platelets (AgNHPs) with small particle sizes (10 nm), narrow distribution and good dispersion are prepared. Especially, smaller sizes (10 nm) and narrower particle size distribution of AgNHPs particles can be easily controlled by using this process. Finally, the conductivity of the ink is excellent. For example, when the printed patterns were sintering at 150 °C, the resistivity of the ink(GE: 0.15 g/L) reached the minimum value of 2.2×10−6 Ω·cm. And the resistivity value was 3.7×10−6 Qcm, when it was sintered at 100 °C for 30 min. The conductive ink prepared can be used for the field of printing electronics as ink-jet printing ink.

metallurgy & metallurgical engineering
Facile Synthesis of Silver Nanoparticles and Preparation of Conductive Ink

Gui Bing Hong,Yi Hua Luo,Kai Jen Chuang,Hsiu Yueh Cheng,Kai Chau Chang,Chih Ming,Chih Ming Ma

DOI: https://doi.org/10.3390/nano12010171

IF: 5.3

2022-01-05

Nanomaterials

Abstract:In the scientific industry, sustainable nanotechnology has attracted great attention and has been successful in facilitating solutions to challenges presented in various fields. For the present work, silver nanoparticles (AgNPs) were prepared using a chemical reduction synthesis method. Then, a low-temperature sintering process was deployed to obtain an Ag-conductive ink preparation which could be applied to a flexible substrate. The size and shape of the AgNPs were characterized by ultraviolet–visible spectrophotometry (UV-Vis) and transmission electron microscopy (TEM). The experiments indicated that the size and agglomeration of the AgNPs could be well controlled by varying the reaction time, reaction temperature, and pH value. The rate of nanoparticle generation was the highest when the reaction temperature was 100 °C within the 40 min reaction time, achieving the most satisfactorily dispersed nanoparticles and nanoballs with an average size of 60.25 nm at a pH value of 8. Moreover, the electrical resistivity of the obtained Ag-conductive ink is controllable, under the optimal sintering temperature and time (85 °C for 5 min), leading to an optimal electrical resistivity of 9.9 × 10−6 Ω cm. The results obtained in this study, considering AgNPs and Ag-conductive ink, may also be extended to other metals in future research.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology,chemistry
One-step Synthesis of Ag Nanoparticles for Fabricating Highly Conductive Patterns Using Infrared Sintering

Wei Li,Xiaoxue Xu,Wenjiang Li,Peng Liu,Yun Zhao,Qiongying Cen,Minfang Chen

DOI: https://doi.org/10.1016/j.jmrt.2019.10.039

2020-01-01

Abstract:Synthesizing metal nanoparticles (NPs) for conductive nano-ink applications on a large-scale and in a green, facile method is important. Here we use an ultrasonic-assisted method to synthesize Ag NPs with an average diameter of 15.5±1.0nm in poly(N-vinylpyrrolidone) (PVP) solutions containing ascorbic acid (Vc) and glucose as mixed reducing agents. TEM, HR-TEM and XRD analysis confirmed the purity of Ag NPs. A thin, mixed Vc and PVP layer on the surface of the Ag NPs, confirmed by TGA and FT-IR, offered the air-stability of the Ag NPs. A rapid and effective sintering method was employed to obtain highly conductive patterns and avoid substrate damage. Upon sintering, the mixed layer quickly decomposed to obtain a highly conductive net. Infrared sintering at 15W for <60s was used to make conductive patterns whose resistivity reached up to 7.4±0.5μΩcm, 4.6 times that of the bulk Ag. Three methods of the pattern designs were tested for conductivity and applicability. A sample paper-based electrode, RFID antenna, and our school logo were successfully printed and all exhibited good flexibility and conductivity. Both the synthesis and sintering process can be easily integrated into one machine, which is promising for future applications.
Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Haijiao Zhan,Jiayu Guo,Jiali Shen,Xiaorong Wang,Zhonghua Fan,Bing Guo,Wei Liu,Hangyan Shen

DOI: https://doi.org/10.1007/s11664-019-06957-6

IF: 2.1

2019-01-24

Journal of Electronic Materials

Abstract:Silver microparticles have inspired much research interest due to their enhanced properties for use in optical, electric, catalytic, and magnetic applications. One such use is as electrically conductive filler for printed electronics. A manufacturing approach has been developed to prepare low-curing-temperature silver pastes. Firstly, silver flakes were synthesized directly by a one-step aqueous-phase reduction reaction, using silver nitrate as silver salt precursor and iron(II) sulfate heptahydrate as reducing agent. Various silver flake samples were synthesized by controlling experimental parameters such as the reaction temperature, surfactant concentration, and reducing agent concentration. The obtained silver powders were characterized by x-ray diffraction analysis, scanning electron microscopy, and dynamic light scattering measurements. The results revealed that the morphology of the silver powders was a plate-like structure with diameter of 1 μm to 1.5 μm and thickness of 30 nm. The prepared silver flakes were then used directly without ball milling to prepare low-curing-temperature silver pastes. The bulk resistivity of a line screen-printed using silver paste containing 48 wt.% (34 ± 5 vol.%) silver flakes and cured at 140°C for 30 min in air was about (1.773 ± 0.118) × 10−6 Ω m. More importantly, the prepared screen-printed patterns exhibited excellent durability in terms of peel strength and folding endurance.

engineering, electrical & electronic,materials science, multidisciplinary,physics, applied
Conductivity enhancement of Ag nanowire ink by decorating in situ formed Ag particles under low-temperature sintering

feng junyan,Bo Xing,Jiahao Xu

DOI: https://doi.org/10.1088/1361-6528/ad21a4

IF: 3.5

2024-01-25

Nanotechnology

Abstract:Silver nanowires (AgNWs) have attractive applications in the fabrication of flexible electronics because of their adequate electrical conductivity, mechanical properties, and oxidation resistance. However, the film produced by AgNW ink needs to be sintered at temperatures above 200 °C to obtain high electrical conductivity, which is incompatible with commonly used flexible substrates such as paper or polymer materials. In this study, the AgNW network was decorated by in situ reduced Ag particles (AgPs) to improve the structural integrity and conductivity of the film. After sintering at 80 °C, the pores and voids within the AgNW network were filled with Ag particles smaller than 200 nm, and the porosity of the film was markedly reduced. The lowest resistivity value was 3.9×10-5 Ω•cm after sintering at 100 °C, only 10.8% and 8.5% of the resistivity values of the films produced from AgNW and ion inks, respectively. During sintering, Ag nucleated on the surface of AgNWs, and its growth and agglomeration resulted in interconnections between the AgNWs and Ag particles. Thereafter, the bridging and filling effect of the Ag particles facilitated the formation of a compact and firm network, improving the film conductivity. The line film printed from the composite ink with 10 layers exhibited a low resistivity of 7.3×10-7 Ω•m. Even after 5000 bending cycles, the resistivity of the line only increased by 4.47×10-6 Ω•cm from the initial value. The composite ink reported in this study is a promising candidate for the low-cost printing of ultralow-power-consumption wearable electronic devices.

materials science, multidisciplinary,physics, applied,nanoscience & nanotechnology
Green Approach to Prepare Silver Nanoink with Potentially High Conductivity for Printed Electronics

Yan-Long Tai,Ying-Xia Wang,Zhen-Guo Yang,Zhi-Qiang Chai

DOI: https://doi.org/10.1002/sia.3737

2011-01-01

Surface and Interface Analysis

Abstract:A new strategy was described for green preparation of silver nanoink with potentially high conductivity for printed electronics. Silver nanoparticles in the ink were characterized by visible ultraviolet spectrophotometer (UV‐vis), Transmission Electron Microscope (TEM), size distribution analysis (SDA), X‐Ray Diffractomer (XRD) and differential scanning calorimetry (DSC). Silver thin film was investigated by SEM and 4‐point probe. It can be found that silver nanoparticles are of small sizes about 2.1 ± 0.5 nm in diameter, with a low melting point of about 105°. It also can be concluded that continuous silver thin film has formed, and an integrated conductive track has been fabricated. Especially, when the solid content is up to 9 wt.% and the sintering condition is 200° for 30 minutes in air, the resistivity can decrease to 8.1 µΩ·cm, 4.9 times the bulk silver resistivity. In addition, the application of silver nanoink in conductive patterns on polyimide (PI) substrate was also studied by inkjet printing. Copyright © 2011 John Wiley & Sons, Ltd.
Facile synthesis of monodisperse silver nanoparticles for screen printing conductive inks

Zhuang Wang,Xianwen Liang,Tao Zhao,Yougen Hu,Pengli Zhu,Rong Sun

DOI: https://doi.org/10.1007/s10854-017-7614-y

2017-08-04

Abstract:Monodisperse silver nanoparticles with high concentration are successful synthesized by a modified polyol process under a relatively low mass ratio of PVP to AgNO3. The obtained silver nanoparticles with excellent stability and dispersity possess a mean diameter of about 118 nm and the yield reach to 80 wt%. Then, using the as-prepared silver nanoparticles as filler together with other additives, conductive inks were formulated. This kind of conductive ink could be screen-printed on polyimide substrates to obtain a series of electrical conductive circuits. A relatively low resistivity of 8.3 × 10− 6 Ω·cm which was only five times larger than that of bulk silver was achieved under sintering at 220 °C for 30 min under air atmosphere. Meanwhile, the electrical conductive circuits kept outstanding mechanical performance. So this silver nanoparticles filled electrical conductive inks has the potential applications in flexible wearable devices.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Direct Writing Highly Conductive Silver Pattern on Flexible Substrate Based on Particle-Free and Ionic Liquid-Assisted Ink

Xiaosheng Xie,Zijian Wu,Daocheng Pan,Xinan Shi

DOI: https://doi.org/10.1088/1742-6596/2785/1/012111

2024-07-04

Journal of Physics Conference Series

Abstract:Particle-free silver inks have the advantage of low sintering temperature, high stability, and easy synthesis over traditional nanoparticle-based silver inks, which have been widely applied in the printing electronic industry. In this paper, we develop a novel particle-free and ionic liquid-assisted silver ink consisting of silver acetate and formic acid/iso-propanolamine liquid that can be used to print highly conductive silver patterns at low sintering temperatures. A variety of continuous and consistent silver circuits with a resistivity of 7.7 μΩ·cm can be printed by a dispenser machine, which is only 4.8 times bulk silver. Furthermore, the low-resistivity silver patterns can be also printed on the flexible polyimide foil, which maintains the stability of resistivity and mechanical properties after bending multiple times, demonstrating that our ionic liquid-assisted silver ink can be applied in flexible electronic devices. Besides, our particle-free silver ink can be utilized to write electric circuits directly with a ball-point pen.
Green Synthesis of Micron-Sized Silver Flakes and Their Application in Conductive Ink

Wei Li,Xiaoxue Xu,Wenjiang Li,Yun Zhao,Minfang Chen

DOI: https://doi.org/10.1007/s10853-017-1962-0

IF: 4.5

2018-01-01

Journal of Materials Science

Abstract:A facile, green method for fabrication of conductive ink composed of Ag flakes was developed for use in flexible printed electronics. The Ag flakes were prepared using AgNO3, nontoxic l-ascorbic acid (Vc) and polyvinylpyrrolidone (PVP) serving as a metal salt, reducing agent and capping agent, respectively. The prepared Ag flakes were characterized by XRD, SEM, and TGA. The combination of PVP and FeCl3 was found to be critical for the formation of the Ag flakes, and reaction activity was affected by temperature. Samples obtained at 140 °C were composed of Ag flakes with an average size of 0.94 ± 0.3 μm. A new fabrication method for producing conductive patterns was designed using a syringe with varying dispersion areas, allowing the ink (Ag flakes and organic solvent) to be applied directly onto a flexible photo paper. The conductivity and flexibility of the pattern were experimentally tested under varying reaction temperatures and bending cycles. Increasing contact area and packing density between Ag flakes resulted in an improved conductivity of the bending pattern. After more than 5000 bending cycles, the patterns were sintered at 160 °C and the resistivity increased from 4.6 ± 0.6 to 22.4 ± 0.8 μΩ cm, acceptable values for practical applications. Sample conductive lines drawn by the Ag flake ink exhibited excellent conductive performance and mechanical integrity, demonstrating a promising method for the formation of flexible microelectrodes or electronic devices.
Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

Haijiao Zhan,Jiayu Guo,Xiazhen Yang,Bing Guo,Wei Liu,Hangyan Shen,Xiaorong Wang,Weigang Tang,Fei Chen

DOI: https://doi.org/10.1007/s10854-019-02511-6

2019-11-12

Abstract:There is a growing demand for silver pastes and inks used in the field of printed electronics. The synthesis of organic surfactant stabilized silver micro-flakes by the solution-phase chemical reduction method at room temperature has attracted wide attention due to its simple equipment, convenient operation and affordable price. However, the electrical conductivity of silver micro-flakes-filled conductive pastes and inks are significantly influenced by residual surfactants. Therefore, the surface modification of silver micro-flakes to remove surface adsorbents becomes a key issue. In this study, the silver frameworks based on the self-sintering silver micro-flakes at room temperature are developed for silver pastes with excellent conductivity. The silver paste with 48 wt% of the sodium nitrate and succinic acid treated silver powders has a resistivity of 1.08 × 10−6 Ω m and excellent adhesion strength after being cured at 140 °C in an oven.

engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
Preparation of stable aqueous conductive ink with silver nanoflakes and its application on paper-based flexible electronics

Yanlong Tai,Zhenguo Yang

DOI: https://doi.org/10.1002/sia.3839

2012-01-01

Surface and Interface Analysis

Abstract:A new kind of stable aqueous conductive ink with silver nanoflakes was developed, which was also used to fabricate conductive patterns on weighing paper for flexible electronics by direct writing. Silver nanoflakes of different sizes were characterized by transmission electron microscopy. The physical properties of the conductive ink were investigated by a dynamic contact angle system, Ubbelohde viscometer, and a surface tension instrument. Conductive properties of paper-based conductive patterns were also investigated by 4-point probe, scanning electron microscopy, X-ray diffraction and Uscan explorer with a 3D profilometer system. It is demonstrated how the formulation of conductive ink affects the surface morphology, microstructure conductivity, and line width of conductive patterns. It can be obtained that the paper-based conductive patterns have low resistivity. Especially, when the sintering condition is 200 degrees C for 20 min, the resistivity can be down to 9.4 mu Omega.cm. The application of the ink on an antenna for radio frequency identification was also studied. Copyright (C) 2011 John Wiley & Sons, Ltd.
Development of Silver Nanoparticle Ink for Printed Electronics

Yiliang Wu,Ping Liu,Tony Wigglesworth

DOI: https://doi.org/10.4071/isom-2012-wp51

2013-01-01

Journal of Microelectronics and Electronic Packaging

Abstract:Printable conductors with high conductivity would be critical for low-cost printed electronics. In view of printability, conductivity, and electrical stability, metal such as gold or silver derived from solution-deposited precursor compositions would be an ideal candidate. Xerox has been exploring the use of silver nanoparticles as conductor precursor composition for printed electronics. This paper reviews our research in the development of alkylamine-stabilized silver nanoparticles that can be sintered at low temperature (∼ 120 °C) for high conductivity (>10000 S/cm). Silver nanoparticle ink formulations based on these silver nanoparticles exhibit surface-energy independent printability which enables the fabrication of high-performance top-contact transistor devices, and self-assembly characteristic when printed on hydrophilic substrates which allows for large-area, defect-free source drain arrays to be printed with a narrow and uniform channel length.
Fabrication of paper-based conductive patterns for flexible electronics by direct-writing

Yanlong Tai,Zhenguo Yang

DOI: https://doi.org/10.1039/c0jm03065a

2011-01-01

Journal of Materials Chemistry

Abstract:A kind of conductive pen was designed, prepared with nano-silver colloid as the conductive ink and gel-ink pen as the writing implement, and used to draw conductive patterns on paper substrate by direct-writing for flexible electronics. Silver nanoink (20 wt%) was characterized using field emission transmission electron microscopy (FETEM), size distribution analyser (SDA), differential scanning calorimetry (DSC), X-ray diffraction (XRD) and selected-area electron diffraction (SAED). Paper-based conductive patterns were investigated by a surface profilometer, a 4-point probe, scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) analysis. It can be found that silver nanoparticles have a small size, about 2.1 +/- 0.5 nm in diameter with monodispersity, and the melting point sharply decreased to 105 degrees C. A conductive line drawn on weighing paper not only had good mechanical/electrical fatigue properties, but also low resistivity. Especially, when the sintering condition is 200 degrees C for 60 min, the resistivity can be down to 6.8 mu Omega cm, 4.25 times the bulk resistivity. In addition, the reparation of conductive patterns and application in a practical circuit were also studied.
Enhancing the electrical properties of inkjet-printed silver ink by electrolyte sintering, photonic sintering, and electroless plating

Yusuke Mukai,Minyoung Suh

DOI: https://doi.org/10.2298/sos2101119m

2021-01-01

Science of Sintering

Abstract:Conductive inkjet printing is an emerging rapid manufacturing technology in the field of smart clothing and wearable electronics. The current challenge in conductive inkjet printing includes upgrading of electrical performance of printed inks to the equivalent level to traditional conductors such as bulk silver and copper, especially for high-performance electronic applications such as flexible antennas and circuits. Post-treatments are commonly employed to enhance the electrical conduction of inkjet-printed tracks. This research discusses the effects of electrolyte sintering, photonic sintering and electroless copper plating on the DC electrical resistance and resistivity of inkjet-printed silver nanoparticles. From experimental results and measurements, it was found that all the post-treatment methods effectively improved the electrical properties of printed silver ink, but in different ways. The lowest resistance of 4.5 ? (in 0.1 mm ? 10 mm) and thickest (4.5 ?m) conductor were achieved by electroless copper plating, whereas the lowest resistivity (7.5?10-8 ??m) and thinnest (1.0 ?m) conductor were obtained by photonic sintering.

metallurgy & metallurgical engineering,materials science, ceramics
High-reproducibility, Flexible Conductive Patterns Fabricated with Silver Nanowire by Drop or Fit-to-flow Method

Yu Tao,Yuxiao Tao,Liuyang Wang,Biaobing Wang,Zhenguo Yang,Yanlong Tai

DOI: https://doi.org/10.1186/1556-276x-8-147

2013-01-01

Nanoscale Research Letters

Abstract:An unusual strategy was designed to fabricate conductive patterns with high reproducibility for flexible electronics by drop or fit-to-flow method. Silver nanowire (SNW) ink with surface tension of 36.9 mN/m and viscosity of 13.8 mPa s at 20°C was prepared and characterized using a field emission transmission electron microscope, X-ray diffractometer, thermogravimetric analyzer, scanning electron microscope, and four-point probe. Polydimethylsiloxane (PDMS) pattern as template was fabricated by spin coating (500 rpm), baking at 80°C for 3 h, and laser cutting. The prepared SNW ink can flow along the trench of the PDMS pattern spontaneously, especially after plasma treatment with oxygen, and show a low resistivity of 12.9 μΩ cm after sintering at 125°C for 30 min. In addition, an antenna pattern was also prepared to prove the feasibility of the approach.

Parametric study on conductive patterns by low-temperature sintering of micron silver ink

Low-temperature sintering of silver patterns on polyimide substrate printed with particle-free ink

Preparation of Nano-Silver Conductive Ink and Electrode Properties

An conductive ink based on silver oxide complex for low-temperature sintering with dense conductive paths

Fabrication of Polymer Silver Conductor Using Inkjet Printing and Low Temperature Sintering Process

Direct pen writing and atomic-scale molecular dynamics simulation study of a novel silver nano-ink

Preparation of low-temperature sintered high conductivity inks based on nanosilver self-assembled on surface of graphene

Facile Synthesis of Silver Nanoparticles and Preparation of Conductive Ink

One-step Synthesis of Ag Nanoparticles for Fabricating Highly Conductive Patterns Using Infrared Sintering

Synthesis of Silver Flakes and Their Application as Conductive Filler for Low-Curing-Temperature Silver Pastes

Conductivity enhancement of Ag nanowire ink by decorating in situ formed Ag particles under low-temperature sintering

Green Approach to Prepare Silver Nanoink with Potentially High Conductivity for Printed Electronics

Facile synthesis of monodisperse silver nanoparticles for screen printing conductive inks

Direct Writing Highly Conductive Silver Pattern on Flexible Substrate Based on Particle-Free and Ionic Liquid-Assisted Ink

Green Synthesis of Micron-Sized Silver Flakes and Their Application in Conductive Ink

Silver frameworks based on self-sintering silver micro-flakes and its application in low temperature curing conductive pastes

Preparation of stable aqueous conductive ink with silver nanoflakes and its application on paper-based flexible electronics

Development of Silver Nanoparticle Ink for Printed Electronics

Fabrication of paper-based conductive patterns for flexible electronics by direct-writing

Enhancing the electrical properties of inkjet-printed silver ink by electrolyte sintering, photonic sintering, and electroless plating

High-reproducibility, Flexible Conductive Patterns Fabricated with Silver Nanowire by Drop or Fit-to-flow Method