Abstract:Conductive copper nanoinks can be used as a low-cost replacement for silver and gold nanoinks that are used in inkjet printing of conductive patterns. We describe a high-throughput, simple, and convenient method for the preparation of copper nanoparticles in aqueous solution at room temperature. Copper acetate is used as the precursor, hydrazine as the reducing agent, and short chain carboxylic acids as capping agents. The concentration of the carboxylic acid plays a key role in the preparation of such copper nanoparticles. Stable copper nanoparticles with a diameter of less than 10 nm and a narrow size distribution were prepared when high concentrations of lactic acid, citric acid, or alanine were used. Thermogravimetric analysis results showed that any lactic acid or glycolic acid adsorbed on the surface of the copper nanoparticles can be removed at a relatively low temperature, especially, glycolic acid, which can be removed from the surface at about 125 °C. Highly conductive copper films prepared using lactic acid and glycolic acid as capping agents were obtained by drop coating a copper nanoparticle paste onto a glass slide followed by low temperature sintering. The electrical resistivity of the copper film using glycolic acid as the capping agent was 25.5 ± 8.0 and 34.8 ± 9.0 μΩ·cm after annealing at 150 and 200 °C for 60 min under nitrogen, respectively. When lactic acid was used as the capping agent, the electrical resistivity of the copper films was 21.0 ± 7.0 and 9.1 ± 2.0 μΩ·cm after annealing at 150 and 200 °C for 60 min under nitrogen, respectively, with the latter being about five times greater than the resistivity of bulk copper (1.7 μΩ·cm).

Highly conductive films sintered by Au–Ag nanoparticles ink at low temperature

Sintering mechanism of size-controllable Cu-Ag core–shell nanoparticles for flexible conductive film with high conductivity, antioxidation, and electrochemical migration resistance

Facile synthesis of monodisperse silver nanoparticles for screen printing conductive inks

Conductivity enhancement of Ag nanowire ink by decorating in situ formed Ag particles under low-temperature sintering

Synthesis of 10nm Ag nanoparticle polymer composite pastes for low temperature production of high conductivity films

Copper nanoparticles: aqueous phase synthesis and conductive films fabrication at low sintering temperature.

Facile synthesis of low temperature sintering Ag nanopaticles for printed flexible electronics

Facile Synthesis of Silver Nanoparticles and Preparation of Conductive Ink

Facile preparation of particle-free hybrid amine silver ink with synergistic effect for low-resistivity flexible films

Low-temperature sintering of Cu@Ag microparticles in air for recyclable printed electronics

Preparation of a Low Temperature Sintering Silver Nanoparticle Ink and Fabrication of Conductive Patterns on PET Substrate

Room Temperature Sintering of Cu-Ag Core-Shell Nanoparticles Conductive Inks for Printed Electronics

A Bimodal Core–shell Structured Cu–Ag Nanoparticles Based Conductive Ink Capable of Low Temperature Sintering for Printed Flexible Electronics

Nano-Silver Ink of High Conductivity and Low Sintering Temperature for Paper Electronics

One-step Synthesis of Ag Nanoparticles for Fabricating Highly Conductive Patterns Using Infrared Sintering

Enhanced Antioxidant and Size Controllable Cu@Ag Core-Shell Nanoparticles Conductive Inks for Flexible Printed Electronics

Microstructure-tunable Highly Conductive Graphene–metal Composites Achieved by Inkjet Printing and Low Temperature Annealing

Low-temperature reducible particle-free screen-printable silver ink for the fabrication of high conductive electrodes

Conductivity of Silver and Copper Film Printed by Particle-Free Reactive Inks

An conductive ink based on silver oxide complex for low-temperature sintering with dense conductive paths

Preparation Of High-Performance Conductive Ink With Silver Nanoparticles And Nanoplates For Fabricating Conductive Films