Abstract:One of the largest obstacles for Ag based electrically conductive adhesives (ECAs), as an alternative for Pb-containing solders in electronic packaging, is that the conductivity of ECAs is lower than that of solders due to the limited physical contact area between/among conductive fillers and the insulated organic lubricant and metal oxide layers on the surface of the conductive fillers. What's more, the high cost of Ag fillers is also restricting the wide use of Ag based ECAs. In this study, Ag-coated-Cu flakes were chosen as a substitute for Ag flakes to reduce the cost. At the same time, the coating of Cu with an Ag layer could protect the Cu-based fillers from oxidation and corrosion. A mixture of weak reducing agents and substituting agents was selected to treat the Ag-coated-Cu flakes to increase the conductivity of the Ag-coated-Cu based ECAs. During the treatment process, the weak reducing agents can reduce the metal oxides on the filler surfaces, enabling more metallic contacts. Meanwhile, the substituting agents can partially remove or replace the long chain fatty acid lubricants on the metal flakes, improving the electron tunneling between/among neighboring flakes. As such, the multiple effects of the reducing agents and substituting agents can improve the conductivity of the ECAs. By using an appropriate amount of terephthalaldehyde and iodine treated Ag-coated-Cu flakes, the resistivity was reduced to as low as 1.28 x 10(-4) Omega cm for the ECA with 75 wt% content of treated fillers, which is comparable to that of commercially available Ag-filled ECAs (x10(-4) Omega cm). This work suggests that a surface chemical method can enhance the electrical conductivity of metal filler based ECAs.

Effect of Ti3C2Tx/Ag/MWCNTs/Ag MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives

Effect of Ti3C2Tx/Ag MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives

Effect of MXene fillers on the electrical conductivity of Ag-coated Cu conductive adhesives

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

Preparation of MXene and its application in low temperature electrically conductive adhesive

Electrical property enhancement of electrically conductive adhesives through Ag-coated-Cu surface treatment by terephthalaldehyde and iodine

MXene fillers and silver flakes filled epoxy resin for new hybrid conductive adhesives

Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive.

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives

Study of Surface Treatment of Copper Fillers for Improvement of Electrically Conductive Adhesives

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

The multiple synthesis of layered V2CTx-MXene particles as electrically conductive adhesive fillers in printed electronics

Preparation of High Conductive Medium and Establishment of Laege Capacity Conductive Channel

Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

Electrically conductive adhesives filled with surface modified copper particles

Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

Electrically Conductive Adhesives Based on Thermoplastic Polyurethane Filled with Silver Flakes and Carbon Nanotubes

Copper Particles/epoxy Resin Thermosetting Conductive Adhesive Using Polyamide Resin As Curing Agent

Preparation and Characterization of Epoxy Resin Filled with Ti3C2Tx MXene Nanosheets with Excellent Electric Conductivity

Ultrahigh Thermal Conductivity of Epoxy/Ag Flakes/MXene@Ag Composites Achieved by In Situ Sintering of Silver Nanoparticles