Abstract:Conductive polymers have a vast market in integrated circuits (IC) and microsystems packaging to enhance mechanical, thermal, electrical performance, and cost effectiveness[1]. Isotropically conductive adhesives (ICAs) have been explored for attaching encapsulated surface mount components on rigid and flexible printed circuits [2]. However, the practical use of conductive adhesives in surface mount applications is limited because of the weak electric conductivity. Jiang et al [3] used nano-sized silver particles as a candidate for conducting filers in order to reduce the sintering temperature, but the contact resistance is still high. Some groups [4, 5] studied a series of methods such as using carboxylic acid group containing chemicals as surfactants to enhance the conductivity of ICAs in a variety of conditions, but because the micron-sized silver fillers have a high sintering temperature, the enhancement in conductivity is still limited. In order to further improve the conductivity of ICAs and minimize the cost, we experimented on a series of materials for silver surface pretreatment. We noticed an about 20 times improvement in conductivity of the modified ICA than the control sample (75% silver content in all samples). The volume resistivity of the optimum formulation reached the level of 10-6 Omegaldrcm. We also analyzed the adhesion strength and thermal property of the modified ICA material. The study indicated that both the electrical properties and the mechanical property were improved without negatively affecting the other physical properties, and they are both remain stable after subjecting to the 85degC and 85% relative humidity conditioning test.

Electrically conductive adhesives with sintered silver nanowires

Effects of Nano Fillers on the Conductivity, Adhesion Strength and Reliability of Isotropic Conductive Adhesives (ICAs)

The Sintering Behavior of Electrically Conductive Adhesives Filled with Surface Modified Silver Nanowires

Regulation of Multidimensional Silver Nanostructures for High-Performance Composite Conductive Adhesives

Scalable Synthesis of Monodispersed Branched Submicron Silver Particles As the Printed Electrically Conductive Adhesives Fillers

Self-Assembly Synthesis of Silver Nanowires/Graphene Nanocomposite and Its Effects on the Performance of Electrically Conductive Adhesive.

Scalable synthesis of the mono-dispersed silver micro-dendrites and their applications in the ultralow cost printed electrically conductive adhesives

Preparation of silver nanopowders and its application in low temperature electrically conductive adhesive

High conductivity of isotropic conductive adhesives filled with silver nanowires

In Situ Generation of Photosensitive Silver Halide for Improving the Conductivity of Electrically Conductive Adhesives.

Electrical properties of electrically conductive adhesives from epoxy and silver-coated copper powders after sintering and thermal aging

Effect of Flake Silver-Plated Copper Particles on the Property Enhancement of Electrically Conductive Adhesives.

Silver Flakes and Silver Dendrites for Hybrid Electrically Conductive Adhesives with Enhanced Conductivity

Enhancement of electrical properties of anisotropically conductive adhesive joints via low temperature sintering

Conductivity Enhancement of Polymer Composites Using High-Temperature Short-Time Treated Silver Fillers

Isotropical Conductive Adhesives Filled with Silver Nanowires

A study on the resistivity and mechanical properties of modified nano-Ag coated Cu particles in electrically conductive adhesives

The Conduction Development Mechanism of Silicone-Based Electrically Conductive Adhesives

Low Temperature Sintering of Silver Nanoparticle Paste for Electronic Packaging

Using Novel Materials to Enhance the Efficiency of Conductive Polymer

Improving Adhesion Strength and Thermal Conductivity of Nanowire Surface Fastener