Microstructure Regulation and Fabrication of Epoxy-based Conductive Films with Excellent Electrical and Thermal Conductivity, Adhesion, Toughness, and Flexibility

Hongming Yang,Li Zhang,Rong Chen,Shaoyun Guo
DOI: https://doi.org/10.1016/j.polymertesting.2024.108657
IF: 5.1
2024-12-06
Polymer Testing
Abstract:The electrically conductive adhesive films (ECAFs) are new materials used for large-format bonding in microelectronics packaging. However, improving its electrical and thermal conductivity, adhesion, and flexibility simultaneously has been a challenge. In this study, silver powder with different particle sizes and poly(3,4-ethylenedioxythiophene)/poly(styrene sulfonate) (PEDOT/PSS) were used to create a high-efficient multi-scale conductive bridge structure. This reduced the volume resistivity from 7.30×10 -4 Ω·cm to 3.80×10 -4 Ω·cm, with lower silver powder content. The thermal conductivity improved from 9.074 W/m·K to 9.124 W/m·K, and adhesion performance between the epoxy matrix and the metal increased from 6.85 MPa to 8.08 MPa. Furthermore, the addition of hydroxyl-functionalized polyurethane materials enhanced the toughness without significantly affecting its electrical, thermal, and adhesion properties. This study successfully prepared epoxy-based conductive adhesive films with a combination of electrical conductivity, thermal conductivity, adhesion, and flexibility, while significantly reducing costs due to the reduction in silver powder content.
materials science, characterization & testing,polymer science
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