Ambient Temperature–Corrected Mechanical Stress Mapping of Gallium Nitride and Aluminum Indium Gallium Phosphide Films by Raman Scattering Spectroscopy for Characterization of Light‐Emitting Diodes

Xiaoru Guo,Asad Mughal,Darren Dunphy,Gregory Stone,David Miller,Sungwook Huh
DOI: https://doi.org/10.1002/pssa.201900776
2020-02-06
physica status solidi (a)
Abstract:<p>Raman spectroscopy can provide a detailed analysis of mechanical stress in crystalline materials through the measurement of shifts in vibrational frequency. However, ambient temperature drift during measurements can lead to inaccurate mechanical stress values. In this study, 2D Raman mapping analysis of gallium nitride (GaN) and aluminum indium gallium phosphide (AlInGaP) epitaxial films within packaged LED devices reveals micron‐scale localized stress distributions. A temperature‐corrected measurement method is developed to evaluate the mechanical stress of InGaN light‐emitting diode (LED) dies at various LED operating conditions. The impact of die design on mechanical stress is studied for both GaN on Al<sub>2</sub>O<sub>3</sub> (Chip Scale Package, CSP) and GaN thin film flip chip (TFFC) designs. Raman mapping of AlInGaP LEDs is also demonstrated and shows comparable resolution to the GaN LED results.</p><p>This article is protected by copyright. All rights reserved.</p>
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