Reactive Ion Etching of Sol-Gel derived PZT thin film and Pt/Ti bottom electrode for FRAM

Tang Ting-Ao,Chen Zheng,Li Ning,Zou Si-Xun
DOI: https://doi.org/10.1080/00150199908015769
1999-06-01
Ferroelectrics
Abstract:To obtain a AL/PZT/Pt/Ti ferroelectric capacitor, Reactive Ion Etching (RIE) of Pb(Zr,Ti)O3 ferroelectric thin films and Pt bottom electrode with SF6/Ar plasmas is described in this work. The etch rate of PZT and Pt under different power, SF6/Ar gas flow ratio and gas pressure were studied. It's shown that there exists an optimum power, SF6/Ar gas flow ratio and pressure to etch PZT and Pt, respectively. Etch rates of the order of 2–7 nm/min were obtained under different conditions.
materials science, multidisciplinary,physics, condensed matter
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