Abstract:Aspheric thin-walled crucibles with large diameters are widely used for photovoltaics and semiconductor industries, while they have hard-brittle and aspheric characteristics. Nevertheless, these crucibles strictly require atomic surfaces and high material removal rate (MRR). This is a challenge for chemical mechanical polishing (CMP). To break this challenge, a novel green CMP was developed for fused silica, containing ceria, lanthana, hydrogen peroxide, diethylene triaminepentaacetic acid pentasodium, carboxymethyl cellulose sodium and guanidine carbonate. After CMP, surface roughness Ra of 0.115 is obtained at a scanning area of 5 × 5 μm2 measured by atomic force microscopy, and MRR is 563 nm/min. In such an atomic surface, the MRR is the highest compared with those published previously. Transmission electron microscopy confirms that the thickness of damaged layer after CMP is only 2.63 nm. A novel approach of robot floating polishing is proposed for aspheric crucibles with a diameter of 810 mm and a height of 580 mm. Using the developed CMP, surface roughness Sa of 0.178 nm on inner surface of an aspheric thin-walled crucible is achieved under a measurement area of 50 × 50 μm2. X-ray photoelectron spectroscopy (XPS) and electron paramagnetic resonance reveal that the content of Ce3+ increased from 28.54 to 43.76 %. Through Raman, XPS and Fourier transform infrared spectroscopy, CMP mechanisms are elucidated. Densified damaged layer on the surface of fused silica was induced by the transformation of surface structure from six-membered to four- or three-membered network. Ce-OH and Si-OH were formed between fused silica and ceria abrasives, forming Ce-O-Si by condensation reaction of dehydration. The developed green CMP and approach provide new pathway to polish and manufacture atomic surfaces for aspheric thin-walled crucibles with large diameters.

Low-damage Optical Manufacturing Via Plasma Finishing and Figuring

Traceless Mitigation of Laser Damage Precursors on a Fused Silica Surface by Combining Reactive Ion Beam Etching with Dynamic Chemical Etching

Nano-Precision Synergistic Finishing Process Integrated ELID-Grinding and MRF

Study of Form Control Algorithm in Atmospheric Pressure Plasma Processing

Fused Silica Fine Grinding with Low Roughness

Design and development of medium-pressure plasma process for optical substrate finishing: A comparative study with wet chemical etching

Development and Performance Evolution of Medium-Pressure He/SF6/O2-Based Plasma and Wet Chemical Etching Process for Surface Modification of Fused Silica

Study on the Absorption Characteristics and Laser Damage Properties of Fused Silica Optics under Flexible Polishing and Shallow DCE Process

Atomic surface induced by novel green chemical mechanical polishing for aspheric thin-walled crucibles with large diameters

Achieving Ultralow Surface Roughness and High Material Removal Rate in Fused Silica Via a Novel Acid SiO2 Slurry and Its Chemical-Mechanical Polishing Mechanism

Eliminating of Subsurface Damage Structure

Combination of scanning ion beam etching and dynamic chemical etching for improving laser damage resistance of fused silica optics

Atomic-level flatness on oxygen-free copper surface in lapping and chemical mechanical polishing

The influence of chemical etching on the surface quality of phase components

Long-lasting antifogging mechanism for large-aperture optical surface in low-pressure air plasma in-situ treated

Centimeter-scale low-damage micromachining on single-crystal 4H–SiC substrates using a femtosecond laser with square-shaped Flat-Top focus spots

Subsurface Damage Structure and Eliminating

Surface Polishing of Laser Powder Bed Fused Inconel 625 Surfaces Using Multi-jet Hydrodynamic Cavitation Abrasive Finishing: An Emerging Class of Cleaner Surface Enhancement Process

In situ plasma cleaning of large-aperture optical components in ICF

Removal Function and Chemical Composition of RS-SiC Surface Processing by Atmospheric Pressure Plasma Processing

Improving machinability of single-crystal silicon by cold plasma jet