Abstract:Plasma polishing is a relatively new technique successfully applied for polishing optical materials due to its numerous advantages. It includes the high quality of the polished surface, reduced surface and sub-surface defects, high processing speed, etc. This paper investigates surface finish on fused silica using two processes, i.e., medium pressure plasma process and wet chemical etching. The experimental result shows that at a 20 mbar chamber pressure and 80 W radio frequency power, the surface finish of coarse machined and lapped fused silica substrate is better than 5 and 10 mbar. The experiments are also conducted using wet chemical etching on coarse machined and lapped polished fused silica substrates using a mixed hydrofluoric and sulfuric acid solution. However, using wet chemical etching, the percentage increase of surface roughness achieved on lapped and coarse machined surfaces is higher than in the plasma process . The percentage increase in surface roughness is 84.8 % and 98.81 % on coarse surfaces and 69.23 % and 892.3 % on lapped surfaces upto 30 μm material depth using plasma process (at 20 mbar pressure) and wet chemical etching, respectively. The surface microstructure of fused silica before and after processing is investigated using field-emission scanning electron microscopy. The result reveals that plasma polishing significantly reduced the micro-cracks and damaged layers. Energy dispersive X-ray results show the presence of elements fluorine, silicon, oxygen, and carbon on the processed surface, showing evidence of plasma reaction. Moreover, an additional element, i.e., sulfur, also appears on the processed surfaces from the solution during wet chemical etching. The sharp diffraction peaks have not been observed in X-ray diffraction patterns, indicating that the material is amorphous fused silica.

Development and Performance Evolution of Medium-Pressure He/SF6/O2-Based Plasma and Wet Chemical Etching Process for Surface Modification of Fused Silica

Design and development of medium-pressure plasma process for optical substrate finishing: A comparative study with wet chemical etching

Medium Pressure Plasma Processing of Fused Silica: A Comparative Study for Material Removal Rate

Traceless Mitigation of Laser Damage Precursors on a Fused Silica Surface by Combining Reactive Ion Beam Etching with Dynamic Chemical Etching

The Morphology and Chemistry Evolution of Fused Silica Surface after Ar/CF4 Atmospheric Pressure Plasma Processing

Form Control In Atmospheric Pressure Plasma Processing Of Ground Fused Silica

Study on the Key Parameters in Etching of Fused Silica Using Atmospheric Inductively Coupled Plasma

Surface Quality Improvement of Atmospheric Pressure Plasma Polishing (appp) in Machining of Silicon Ultra-Smooth Surfaces

Surface Texture Evolution of Fused Silica in a Combined Process of Atmospheric Pressure Plasma Processing and Bonnet Polishing

Characterization of Fused Silica Surface Topography in Capacitively Coupled Atmospheric Pressure Plasma Processing

Achieving Ultralow Surface Roughness and High Material Removal Rate in Fused Silica Via a Novel Acid SiO2 Slurry and Its Chemical-Mechanical Polishing Mechanism

Development of Computer-Controlled Atmospheric Pressure Plasma Structuring for 2D/3D Pattern on Fused Silica

A study on the etching characteristics of atmospheric pressure plasma for single-crystal silicon wafer

Application of Atmospheric Pressure Plasma in the Ultrasmooth Polishing of SiC Optics

Effect of Input Power and Gas Pressure on the Roughening and Selective Etching of Sio2/Si Surfaces in Reactive Plasmas

Surface Modification of Silicon Carbide Wafers Using Atmospheric Plasma Etching: Effects of Processing Parameters

Atmospheric Pressure Plasma Processing of Fused Silica in Different Discharge Modes

Study of Form Control Algorithm in Atmospheric Pressure Plasma Processing

Reaction ion etching process for improving laser damage resistance of fused silica optical surface

Plasma jet assisted polishing of fused silica freeform optics

Surface roughening of ground fused silica processed by atmospheric inductively coupled plasma