Abstract:Plasma polishing is a relatively new technique successfully applied for polishing optical materials due to its numerous advantages. It includes the high quality of the polished surface, reduced surface and sub-surface defects, high processing speed, etc. This paper investigates surface finish on fused silica using two processes, i.e., medium pressure plasma process and wet chemical etching. The experimental result shows that at a 20 mbar chamber pressure and 80 W radio frequency power, the surface finish of coarse machined and lapped fused silica substrate is better than 5 and 10 mbar. The experiments are also conducted using wet chemical etching on coarse machined and lapped polished fused silica substrates using a mixed hydrofluoric and sulfuric acid solution. However, using wet chemical etching, the percentage increase of surface roughness achieved on lapped and coarse machined surfaces is higher than in the plasma process . The percentage increase in surface roughness is 84.8 % and 98.81 % on coarse surfaces and 69.23 % and 892.3 % on lapped surfaces upto 30 μm material depth using plasma process (at 20 mbar pressure) and wet chemical etching, respectively. The surface microstructure of fused silica before and after processing is investigated using field-emission scanning electron microscopy. The result reveals that plasma polishing significantly reduced the micro-cracks and damaged layers. Energy dispersive X-ray results show the presence of elements fluorine, silicon, oxygen, and carbon on the processed surface, showing evidence of plasma reaction. Moreover, an additional element, i.e., sulfur, also appears on the processed surfaces from the solution during wet chemical etching. The sharp diffraction peaks have not been observed in X-ray diffraction patterns, indicating that the material is amorphous fused silica.

Medium Pressure Plasma Processing of Fused Silica: A Comparative Study for Material Removal Rate

Design and development of medium-pressure plasma process for optical substrate finishing: A comparative study with wet chemical etching

Development and Performance Evolution of Medium-Pressure He/SF6/O2-Based Plasma and Wet Chemical Etching Process for Surface Modification of Fused Silica

Traceless Mitigation of Laser Damage Precursors on a Fused Silica Surface by Combining Reactive Ion Beam Etching with Dynamic Chemical Etching

Study of Form Control Algorithm in Atmospheric Pressure Plasma Processing

Achieving Ultralow Surface Roughness and High Material Removal Rate in Fused Silica Via a Novel Acid SiO2 Slurry and Its Chemical-Mechanical Polishing Mechanism

Surface Modification of Silicon Carbide Wafers Using Atmospheric Plasma Etching: Effects of Processing Parameters

A study on the etching characteristics of atmospheric pressure plasma for single-crystal silicon wafer

Plasma jet assisted polishing of fused silica freeform optics

Thermal analysis of in-situ laser assisted diamond cutting of fused silica and process optimization

UV-ultrashort pulsed laser ablation of fused silica

Study on the Absorption Characteristics and Laser Damage Properties of Fused Silica Optics under Flexible Polishing and Shallow DCE Process

Study of plasma treatment for PDMS surface modification on the fabrication of microfluidic devices

Removal Function and Chemical Composition of RS-SiC Surface Processing by Atmospheric Pressure Plasma Processing

Femtosecond laser modification combined with chemical etching to achieve high-quality cutting of millimeter-thick fused silica

Liquid-Assisted Femtosecond Laser Precision-Machining of Silica.

The stability of radio-frequency plasma-treated polydimethylsiloxane surfaces

Efficiency studies of particle removal with pulsed-laser induced plasma

Application of surface analysis in study on removal mechanism and abrasive selection during fused silica chemical mechanical polishing

Evolution of physical and mechanical properties of fused silica after subsurface damage layer removal by RIE treatment

Improving machinability of single-crystal silicon by cold plasma jet