Abstract:INTRODUCTION Single-crystal silicon and germanium are not only dominant semiconductor materials but also important infrared optical materials. The manufacturing of defect-free substrates of silicon and germanium is indispensable for production of precision dark-field optics, optoelectronic elements, and micro electromechanical systems. Usually, silicon and germanium substrates are manufactured by mechanical machining processes such as slicing, cutting, grinding and lapping followed by polishing. However, these processes will inevitably cause subsurface damage to the crystalline structures due to the mechanical contacts between the tools and the workpieces. The subsurface damage includes a microstructural change, namely amorphization, in the near-surface layer, and a dislocation layer beneath the amorphous layer [1-3]. Removing the subsurface damage has become a subject of concentrated research interests from multidisciplinary research communities and industries. Currently, chemical etching and/or chemo-mechanical polishing (CMP) are carried out after the machining processes to remove the damaged layers. However, due to the poor controllability in processing depth, deterioration of form accuracy becomes a big problem. Other issues, such as increase in production cost, and environmental pollution due to the chemical waste fluids, are also serious problems. Instead of removing the damaged surface layer, an alternative method currently being considered is the use of laser irradiation to repair the subsurface damage [4]. The purpose of the present work is to explore the possibility of generating perfect single crystalline structures on grinding-damaged semiconductor substrates by nanosecond-pulsed laser irradiation.

Subsurface Damage Structure and Eliminating

Eliminating of Subsurface Damage Structure

Incined Magnetorheological Finishing and Its Path Controlling

Method of Damage Characterization of Engineering Ceramics Grinding Surface

Form Error of Optical Surface Repaired by Wet-Etch Figuring

Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing

A Study on the Surface Quality and Damage Properties of Single-Crystal Silicon Using Different Post-Treatment Processes

Ductile deformation and subsurface damage evolution mechanism of silicon wafer induced by ultra-precision grinding process

Scratch Morphology Transformation: An Alternative Method of Scratch Processing on Optical Surface

Grinding damage of BK7 using copper-resin bond coarse-grained diamond wheel

Influence mechanism of defects on the subsurface damage and structural evolution of diamond in CMP process

Creating extreme subsurface integrity by laser-induced material self-organization

Confocal laser scanning and 3D reconstruction methods for the subsurface damage of polished optics

Investigation of Material Removal Distributions and Surface Morphology Evolution in Non-Contact Ultrasonic Abrasive Machining (NUAM) of BK7 Optical Glasses

Interference mechanism and damage accumulation in high-speed cross scratches on hard brittle materials

Review on Surface Polishing Methods of Optical Parts

Edge Control in the Computer-Controlled Optical Surface

Research and application on the key techniques of conformal vibration polishing on optics

Modeling and Experimental Verification of Time-Controlled Grinding Removal Function for Optical Components

Mechanism of Surface Defects in Ultra-Precision Machining of Sesquioxide Laser Crystal Tm: GdScO3

Subsurface damage evaluation in the single abrasive scratching of BK7 glass by considering coupling effect of strain rate and temperature