Abstract:Ultra-smooth silicon surfaces, crucial in short-wave optics, can be marred by surface defects and subsurface damage incurred during machining, thereby affecting the imaging quality and transmission efficiency of optical components. Laser micro-polishing emerges as a versatile and efficient technique for ultra -precision polishing. This study aims to scrutinize the surface topography and subsurface structural evolution of monocrystalline silicon wafers during laser micro-polishing experimentally and to formulate an accessible evaluation model that incorporates multiple process parameters for optimal polishing results. As laser fluence escalates, the polishing process can be divided into six regimes: bulge, coalescence, smoothness, groove, ripple, and ablation. Each regime ' s crystal structure evolution is analyzed using Raman spectroscopy, demonstrating a close relationship with the surface expansion preceding the melting of monocrystalline silicon. Surface roughness diminishes from 6 nm to 0.7 nm, and an optimal crystalline quality devoid of an amorphous layer, residual stress, or significant subsurface damage is achieved. Amorphous silicon, 20 mu m thick, is converted into monocrystalline silicon through recrystallization, and subsurface distortions and dislocations are rectified due to silicon atom redistribution. Moreover, a mapping relationship between multiple process parameters and surface polishing effects is established. A dimensionless fluence considering multiple parameters is derived, and a predictive model for process parameter optimization to secure optimal polishing results is proposed.

Eliminating of Subsurface Damage Structure

Subsurface Damage Structure and Eliminating

Detection of Subsurface Damage and Material Removal Mechanism in Optical Polishing Process

Fabrication of Supersmooth Surfaces with Low Subsurface Damage

Subsurface Damage Detection And Damage Mechanism Analysis Of Chemical-Mechanical Polished Optics

Investigation On Hf Based Etching Of The Polished K9 Glasses And Its Application In The Subsurface Damage

Optical Subsurface Damage Evaluation Using LSCT

Study on subsurface damage depth and morphology of optical elements

Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing

A Study on the Surface Quality and Damage Properties of Single-Crystal Silicon Using Different Post-Treatment Processes

Identification of subsurface damage of 4H-SiC wafers by combining photo-chemical etching and molten-alkali etching

Quantitative Evaluation of Subsurface Damage by Improved Total Internal Reflection Microscopy

Rapid detection of subsurface damage ofoptical materials in lapping process and its influence regularity

Confocal laser scanning and 3D reconstruction methods for the subsurface damage of polished optics

Research on the Subsurface Damage During Finishing for Optics

The Study on Subsurface Damage Depth and Morphology of Optical Material

Detailed Subsurface Damage Measurement And Efficient Damage-Free Fabrication Of Fused Silica Optics Assisted By Ion Beam Sputtering

Evolution mechanism of subsurface damage during laser machining process of fused silica

Surface Topography and Subsurface Structure Evolution in Laser Micro Polishing of Monocrystalline Silicon

Subsurface damage distribution in the lapping process.

Fabrication of Supersmooth Optical Elements with Low Surface and Subsurface Damage