Abstract:Gallium nitride high electron mobility transistor (GaN HEMT) devices have become critical components in the manufacturing of high-performance radio frequency (RF) or power electronic modules due to their superior characteristics, such as high electron saturation speeds and high power densities. However, the high heat characteristics of GaN HEMTs make device level cooling a critical problem to solve since performance degradation or even failure may occur under high temperatures. In this paper, we proposed a 2.5D integration method with device-level microchannel direct cooling for a high-power GaN HEMT device. To demonstrate this technological concept, a multigate GaN HEMT device featuring a gate length/width/source drain spacing of 0.5 μm/300 μm/6 μm that underwent in-house backside thinning and metallization was used as the test vehicle. A high-resistivity silicon (HR Si) interposer embedded with four-layer microchannels was designed, having widths/pitches of 30 μm/30 μm at the top microchannel. The high-power GaN HEMT device was soldered on a Si interposer embedded with open microchannels for heat dissipation. A pair of GSG Pad chips was soldered simultaneously to display the capacity for the heterogeneous integration of other chip types. Thermal property evaluation was conducted with experiments and simulations. The test results showed that the maximum surface temperature of the GaN HEMT device decreased to 93.8 °C when it experienced a heat dissipation density of 32 kW/cm2 in the gate finger area and an average heat dissipation density of 5 kW/cm2 was found in the active area with the DI water coolant at a flow rate of 3 mL/min. To our knowledge, among recently reported works, this finding was the best cooling capacity of heterogeneously integrated microchannels for GaN HEMT devices. In addition, this technology was scalable regarding the numbers of gate fingers or GaN HEMT devices.

Electro-Thermal Simulation of GaN HEMT by Finite Element Method

Thermal Effect Simulation of GaN HFETs under CW and Pulsed Operation.

Numerical investigation on thermal characteristics of GaN HFETs for high power applications

Investigation on Thermo-Mechanical Responses in High Power Multi-Finger AlGaN/GaN HEMTs

Transient Thermal Analysis of GaN Heterojunction Transistors (HFETs) for High-Power Applications

Electro-Thermal Simulation of GaN HEMT Based on a Scaling-Factor-Enhanced Time-Domain Spectral Element Solver

Electrothermal Simulation Analysis of GaN HEMT with RF Dynamic Current

Suppressing Temperature Rise in AlGaN/GaN HEMT with Graphene Layers

Thermal modeling, analysis, and management of high-power GaN transistors

High Speed Transient Thermal Simulation of GaN HEMT Devices

Study of Self-Heating and High-Power Microwave Effects for Enhancement-Mode p-Gate GaN HEMT

Multiphysics Simulation Study of Thermal Stress Effects in Nanoscale FinFETs Heterogeneously Integrated with GaN High-Power Device on Silicon Substrate

Study of Thermal Simulation Technology for GaN Power Devices

Two-temperature Principle for Evaluating Electrothermal Performance of GaN HEMTs

Active Thermal Management of GaN-on-SiC HEMT with Embedded Microfluidic Cooling

Thermal Property Evaluation of a 2.5D Integration Method with Device Level Microchannel Direct Cooling for a High-Power GaN HEMT Device

Experimental Study and Characterization on the Thermo-Electro Multiphysics Coupling Failure of GaN HEMTs Under High-Power Microwave Pulse

Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs

Nonlinear Thermal Analysis of AlGaN/GaN HEMTs With Temperature-Dependent Parameters

Two-Temperature Principle for Electrothermal Performance Evaluation of GaN HEMTs

Self-Heating and Equivalent Channel Temperature in Short Gate Length GaN HEMTs