Full 3D Thermal Simulation of GaN HEMT using Ultra-Fast Self-Adaptive Computations Driven by Experimentally Determined Thermal Maps

A. Helou,M. Tadjer,P. Raad,K. Hobart
DOI: https://doi.org/10.1109/THERMINIC.2018.8593301
2018-09-01
Abstract:A 3D model is built to fully characterize the thermal performance of a GaN HEMT device. Surface temperature maps obtained experimentally are used for the validation of the thermal model. A search method optimizes the input parameter set that results in minimum error between the numerical and the experimental temperature distribution at the surface of the device. The model results are matched to experimental thermoreflectance imaging results obtained at different activation power levels. This experimentally validated thermal model thus provides a full 3D temperature distribution for the activated HEMT device and the optimized input parameter file can provide the actual thermal characteristics of the device under test.
Engineering,Materials Science,Physics
What problem does this paper attempt to address?