Abstract:Sputtering has been widely used to prepare thin film due to its good cohesion with substrate, high purity, compactness, repeatability and large area manufacture. Target is a key consumable material during production of thin film by sputtering. Generally, targets are mostly rare and high purity metal, so the cost of target is very high. In order to reduce the cost of target, to improve its stiffness, and to enhance the electrical and thermal conductivity, target is usually connected with backplane to form the target assembly. The main connection method is diffusion welding, which is used in the industrial production. However, the target and the backplane are usually two different materials with different physical properties such as coefficient of thermal expansion (CTE) and thermal conductivity. During the welding or soldering process of target, the mismatch of physical properties will lead to residual stress in target, which has a direct influence on the thickness and microstructure uniformity of the films. Hence, it is very meaningful to investigate the residual stress in target and to study its influencing factor. Based on the Co/ Al/Cu sandwich structure of backplane diffusion welding, the effects of Al interlayer and Ni(V) layer on welding residual stress were studied by finite element method. It was found that the application of the Al interlayer not only can make diffusion welding process easier and lower the diffusion welding temperature, but also can reduce the maximum residual stress from 142 MPa to 126 MPa. Furthermore, the location of the maximum residual stress also changes from the outer edge of the interface between target and backplane to the position near the symmetrical axis of target and Co/Al interface. Furthermore, there is an optimal thickness for Al interlayer (7 mm). Although the existence of Ni(V) layer can inhibit the generation of brittle intermetallic compounds at the interface of Co/Al and Cu/Al, it also increases the residual stress. Moreover, we find that the increase of residual stress with Ni(V) layer at only Co/Al interface, is smaller than that of adding Ni(V) layer at both Co/Al and Cu/Al interfaces.

The Influence of the Interlayers Thicknesses on the Stress-Strain State in the Nodes with Soft Interlayer of IC10 Superalloy

Influence of the Modulus of Elasticity of the Jointed Material and Interlayers in Nodes with an Interlayer with a Low TCLE

Effects of Al Interlayer and Ni(V) Transition Layer on the Welding Residual Stress of Co/Al/Cu Sandwich Target Assembly

Finite element modeling of residual stresses in the diffusion bonding joints of TC4/QA110-3-1.5

The Importance of Interfacial Stress-Affected Zone in Evading the Strength-Ductility Trade-off of Heterogeneous Multi-Layered Composites

Distributions of Residual Stresses in Diffusion Bonding of Dissimilar Materials Intermetallics Tial to Steel 40cr and Effect of Interlayer

Evaluation of Weak Interface Effect on the Residual Stresses in Layered SiC/TiC Composites by the Finite Element Method and X-Ray Diffraction

The Effect of Cavities and Channels on the Strength of LTCC Substrate

Evolution of residual stress and interface coherency and their impact on deformation mechanisms in Al/Ti multilayers

Distributions of Residual Stresses in Diffusion Bond of Dissimilar Materials and Effect of Interlayer

Modeling the Effect of Diffusion Layer and Interface on the Flow Stress for a Ni/Al Laminate Prepared by Vacuum Hot Pressing

Effect of LY12 Alloy Constraint on the Ductile to Brittle Transition of Al Interlayer

Effect of Ni Interlayer Thickness on the Welding Morphology and Mechanical Properties of SPS Diffusion-Welded YG8/40Cr Joints

Size effect of layer thickness on stress fields due to interface core-spreading dislocation arrays in multilayers

Stress State of a Soft Interlayer under Conditions of Plane and Axisymmetric Strains

Residual Stresses and Mechanical Properties of Si 3 N 4 /sic Multilayered Composites with Different SiC Layers

Interfacial Stress in Through Silicon Vias

Influence of Thickness of Interfacial Imc Layer and Solder Mask Layer on Mechanical Reliability of Micro-Scale Bga Structure Interconnects

Effect of Interlayer on the Residual Stresses Within High-Temperature Coating

Regulation of welding residual stress in laser-welded AISI 304 steel-niobium joints using a Cu interlayer

Layer Thickness-Dependent Hardness and Strain Rate Sensitivity of Cu–Al/Al Nanostructured Multilayers