Abstract:Creating micrometer-resolution high-aspect-ratio three-dimensional (3D) structures remain very challenging despite significant microfabrication methods developed for microelectromechanical systems (MEMS). This is especially the case when such structures are desired to be metallic to support electronic applications. Here, we present a microfabrication process that combines two-photon-polymerization (2PP) printing to create a polymeric high-aspect-ratio three-dimensional structure and electroless metal plating that selectively electroplates only the polymeric structure to create high-aspect-ratio 3D metallic structures having micrometer-resolution. To enable this, the effect of various 2PP processing parameters on SU-8 photoresist microstructures were first systematically studied. These parameters include laser power, slicing/hatching distances, and pre-/post-baking temperature. This optimization resulted in a maximum aspect ratio (height to width) of ~ 12. Following this polymeric structure printing, electroless plating using Tollens' Reagent were utilized to selectively coat silver particles only on the polymeric structure, but not on the silicon substrate. The final 3D metallic structures were evaluated in terms of their resistivity, reproducibly showing resistivity of ~ 10-6 [Ω·m]. The developed 3D metallic structure microfabrication process can be further integrated with conventional 2D lithography to achieve even more complex structures. The developed method overcomes the limitations of current MEMS fabrication processes, allowing a variety of previously impossible metallic microstructures to be created.

Fabrication Of Ultrathick Micromolds Using Jsr Thb-430n Negative Uv Photoresist

Fabrication of Ultrathick Micromolds Using JSR THB-430N Negative UV Photoresist

High aspect ratio ultrathick micro-stencil by JSR THB-430N negative UV photoresist

Angle Effect of Ultrasonic Agitation on the Development of Thick JSR THB-430N Negative UV Photoresist

Rapid Prototyping of Soft Lithography Masters for Microfluidic Devices Using Dry Film Photoresist in a Non-Cleanroom Setting

A New Fabrication Process for Uniform SU-8 Thick Photoresist Structures by Simultaneously Removing Edge Bead and Air Bubbles

Fabrication of High-Aspect-ratio Microstructures Using SU8 Photoresist

Indirect removal of SU-8 photoresist using PDMS technique

Process Research of High Aspect Ratio Microstructure Using SU-8 Resist

Fabrication of Su-8 Moulds on Glass Substrates by Using A Common Thin Negative Photoresist As an Adhesive Layer

A novel fabrication method of embedded micro-channels by using SU-8 thick-film photoresists

Thick Photoresists for Electroforming Metallic Microcomponents

Fabrication of a Three-Layer SU-8 Mould with Inverted T-shaped Cavities Based on a Sacrificial Photoresist Layer Technique

Fabrication of a high aspect ratio thick silicon wafer mold and electroplating using flipchip bonding for MEMS applications

Making Modified Fluoropolymer Molds for Ultraviolet Nanoimprint Lithography

Simplified microfabrication technology for producing SU-8 microstructures with high aspect ratio

A New Fabrication Method for 3D Multilayer Microstructure

Thick SU8 Microstructures Prepared by Broadband UV Lithography and the Applications in MEMS Devices

Technical Study of AZ4620 Thick Photoresist for Micro Fabrication

Towards 11nm Half-Pitch Resolution for a Negative-Tone Chemically Amplified Molecular Resist Platform for Extreme-Ultraviolet Lithography

High-aspect-ratio three-dimensional polymer and metallic microstructure microfabrication using two-photon polymerization